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4results about How to "Injection implementation" patented technology

High vacuum ultra-low temperature semiconductor wafer rapid cooling platform

The present invention provides a high vacuum ultra-low temperature semiconductor wafer rapid cooling platform; this platform can cool a semiconductor wafer with a diameter of 300 mm from room temperature to -120°C within 15 to 30 seconds. The high vacuum ultra-low temperature semiconductor wafer rapid cooling platform is composed of a high vacuum ultra-low temperature cavity and a self-cascade low temperature refrigeration medium circulation closed-circuit system; the self-cascade low temperature refrigeration medium circulation closed-circuit system includes a refrigeration medium circulation pipe and an ultra-low temperature cooling plate, the ultra-low temperature cooling plate and the semiconductor wafer electrostatic chuck are arranged in the high vacuum ultra-low temperature cooling chamber, the semiconductor wafer electrostatic chuck is arranged on the upper side of the ultra-low temperature cooling plate, a coil channel is opened on the ultra-low temperature cooling plate, metal indium is wrapped between the refrigeration medium circulation pipe and the side wall of the coil channel, the refrigeration medium circulation pipe is used for the flow of refrigeration medium, and the two ends of the refrigeration medium circulation pipe extend out of the high vacuum ultra-low temperature cavity respectively, and the refrigeration medium circulation pipe is passed through the refrigeration medium circulation pipe. The platform minimizes the loss of mixed refrigeration medium during transmission, greatly improving the energy efficiency ratio of the entire system.
Owner:PULE (HEFEI) LIGHT TECH CO LTD

Green remediation system for hexavalent chromium polluted underground water and application

The invention discloses a hexavalent chromium polluted underground water green remediation system and application. The hexavalent chromium polluted underground water green remediation system comprises a remediation well body and a non-contact sustainable electron injection system arranged in the remediation well body. The repair well main body comprises a shaft and a through hole formed in the wall of the shaft; the non-contact sustainable electron injection system comprises a medicament chamber and a graphite cathode plate; the medicament chamber is a closed space enclosed by a proton exchange membrane and a sealing plug, and a graphite anode plate and a sodium dithionite solution are accommodated in the medicament chamber; the graphite cathode plate is electrically connected with the graphite anode plate; according to the non-contact sustainable electron injection hexavalent chromium polluted underground water green remediation method, a reducing agent does not need to be added into a water-containing layer, the secondary pollution risk caused by the reducing agent and a product thereof is avoided, and green and efficient hexavalent chromium underground water remediation is achieved.
Owner:WUHAN INFRASTRUCTURE ENVIRONMENTAL PROTECTION ENG CO LTD

A powder injection molding metal parts feeding device

ActiveCN224273301Uprecision injectioninjection implementationElectric machinerySprocket
This utility model relates to the field of metal parts processing technology and discloses a powder injection molding metal parts feeding device. Two sprockets are each fitted with a chain, and a connecting plate is fixedly connected to the outside of the chain. A rotating shaft is fixedly connected inside the connecting plate, and a feeding box is rotatably connected to the outside of the rotating shaft. A baffle is fixedly connected to the outside of the feeding box, and a discharge pipe is fixedly connected inside the feeding box. In this utility model, a motor drives a rotating rod and sprockets to rotate, causing the feeding box on the chain to move. When the baffle hits the top of the hopper opening, the feeding box tilts, and the powder enters the hopper through the discharge pipe and then into the box body, thus achieving automatic feeding. This allows for precise injection of metal powder into the hopper, achieving automated feeding, reducing manual intervention, minimizing direct contact between operators and metal powder, improving production safety, and ensuring the stability of the raw material ratio for each batch of injection molding.
Owner:DONG GUAN WINWAY MIM TECH CO LTD