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45results about How to "Good photodetection performance" patented technology

Hartmann wavefront sensor based on unit photo-sensitive detector array

The invention discloses a hartmann wavefront sensor based on a unit photo-sensitive detector array. The hartmann wavefront sensor consists of a phase spatial light modulator, a microlens array, a single-mode fiber array and the unit photo-sensitive detector array, wherein the front two-order binary phase modulation is carried out on sub-light waves in each sub-aperture of the hartmann wavefront sensor by the phase spatial light modulator at the same time; the modulated sub-light waves are respectively coupled into the single-mode fiber array of a focal plane to achieve mode selection filtering after the micro-lens array is arranged on the phase modulator, and the light intensity after the mode selection filtering is received by the unit photo-sensitive detector array; and wavefront slope information inside each sub-aperture is solved by processing light intensity data, and finally an incident light wave wavefront is rebuilt by using a hartmann wavefront sensor wavefront mode recovery algorithm. According to the hartmann wavefront sensor based on the unit photo-sensitive detector array, the quantity of probe units is reduced, and the problem of decreasing of wavefront measurement accuracy caused by facula discrete sampling is avoided, so that the wavefront measurement accuracy is not affected by decreasing of the quantity of the probe units, and the hartmann wavefront sensor can be applied to the field of high-speed and high-precision wavefront detection.
Owner:INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI

Novel high-performance light modulation thin film transistor based on quantum dot doped gate insulating layer

The invention discloses a novel high-performance light modulation thin film transistor based on a quantum dot doped gate insulating layer. A preparation method thereof comprises the following steps: depositing an active layer and a source and drain electrode contact layer on a base in sequence; spinning quantum dots and organic optical cement on the active layer to prepare the gate insulating layer; etching via holes for connecting the contact layer with active and drain electrodes on the gate insulating layer; and finally preparing a transparent electrode on the gate insulating layer, and etching the transparent electrode as the drain electrode, gate electrode and source electrode of a plane. Besides the three modulation electrodes of a traditional source and drain gate, the thin film transistor device disclosed by the invention can be taken as a fourth end modulation electrode through incident light. The light modulation thin film transistor with photoelectric detection and signal read functions is prepared by using the thin film transistor gate insulating layer doped with the quantum dots, so that the structure and preparation technology of the light modulation thin film transistor are greatly simplified, the dimensions of the device are shortened, and the photoelectric detection performance is improved.
Owner:SOUTHEAST UNIV

Vertical photoelectric detector based on independent tin disulfide nanosheets and manufacturing method

The invention discloses a manufacturing method of a vertical photoelectric detector based on independent tin disulfide nanosheets, and relates to the technical field of photoelectric detectors. The manufacturing method comprises the following steps: I, preparing independent tin disulfide nanosheets which are arranged vertically on a conductive substrate; II, rotationally coating the tin disulfide nanosheets with a transparent insulating layer, and drying in order to encapsulate the tin disulfide nanosheets; III, etching to remove a part of the transparent insulating layer with a plasma etching process in order to expose a part of the tin disulfide nanosheets again; IV, evaporating a layer of transparent metal electrode to obtain a device. A manufacturing process of the vertical photoelectric detector is easy to implement, and the use of a complex and complicated photoetching technology is avoided; compared with a conventional photoelectric detection being of a parallel structure, the vertical photoelectric detector based on the independent tin disulfide nanosheets has the advantages that scattering and doping caused by the substrate are avoided, and light absorption is increased, so that the photoelectric detection performance of the vertical photoelectric detector is improved.
Owner:HARBIN INST OF TECH

Tensile strained germanium MSM photoelectric detector and manufacturing method thereof

The invention provides a tensile strained germanium MSM photoelectric detector and the manufacturing method thereof. The method at least comprises the steps that S1, a substrate is provided and a sacrificial layer and a germanium layer are formed on the substrate in sequence; S2, a metal layer is formed on the germanium layer, and the metal layer provides stress for the germanium layer; S3, the metal layer is patterned and a pair of metal main bases and a pair of metal sub-bases are formed; S4, the germanium layer is patterned and germanium main bases and germanium sub-bases are formed below the metal main bases and the metal sub-bases respectively, and at least one germanium bridge seam is formed between each pair of germanium sub-bases; S5, the portions, below the germanium bridge seams and below the germanium sub-bases, of the sacrificial layer are etched off so that the germanium bridge seams and the germanium sub-bases are suspended in the air, the suspended germanium sub-bases are curved under the action of the action of the metal layer to enable the germanium bridge seams to be stretched, and then the tensile strained germanium MSM photoelectric detector is obtained. According to the tensile strained germanium MSM photoelectric detector and the manufacturing method thereof, the photoelectric detection property of the MSM photoelectric detector can be improved.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Flexible transient silicon thin film photodetector with MSM structure

The invention discloses a flexible transient silicon thin film photodetector with an MSM structure, which mainly solves the problem that the existing photodetector can not simultaneously satisfy the flexible and transient degradable characteristics. The flexible transient silicon thin film photodetector with an MSM structure comprises a flexible substrate layer (1), a bonding layer (2), a siliconthin film active layer (3), an ohmic contact layer (4), a passivation protection layer (5), and a light reflection reduction layer (6), wherein the silicon thin film active layer adopts n-type singlecrystal light doped thin film silicon; a TiO2 insertion layer is arranged in the ohmic contact layer to improve ohmic contact and avoid damages of a high temperature process to the flexible substrate;and the light reflection reduction layer adopts a ZnO seed layer-ZnO nano-cylindrical line array composite structure, high reflection reduction and light trapping can be realized, the absorption angle of the device is widened, the ultraviolet light detection ability is expanded, and the transient degradability is realized. the flexible and transient characteristics of the photodetector an be realized at the same time, and the photodetector can be applied to ultraviolet astronomy, medicine, biology, sky communication, flame detection and pollution monitoring.
Owner:XIDIAN UNIV

Tensile strain germanium msm photodetector and method for making the same

The invention provides a tensile strained germanium MSM photoelectric detector and the manufacturing method thereof. The method at least comprises the steps that S1, a substrate is provided and a sacrificial layer and a germanium layer are formed on the substrate in sequence; S2, a metal layer is formed on the germanium layer, and the metal layer provides stress for the germanium layer; S3, the metal layer is patterned and a pair of metal main bases and a pair of metal sub-bases are formed; S4, the germanium layer is patterned and germanium main bases and germanium sub-bases are formed below the metal main bases and the metal sub-bases respectively, and at least one germanium bridge seam is formed between each pair of germanium sub-bases; S5, the portions, below the germanium bridge seams and below the germanium sub-bases, of the sacrificial layer are etched off so that the germanium bridge seams and the germanium sub-bases are suspended in the air, the suspended germanium sub-bases are curved under the action of the action of the metal layer to enable the germanium bridge seams to be stretched, and then the tensile strained germanium MSM photoelectric detector is obtained. According to the tensile strained germanium MSM photoelectric detector and the manufacturing method thereof, the photoelectric detection property of the MSM photoelectric detector can be improved.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

3-5[mu]m infrared band avalanche photodiode detector and production method thereof

The invention provides a 3-5[mu]m infrared band avalanche photodiode detector (APD) and a production method thereof. The infrared band APD comprises an antireflective film layer, a P+ type InSb electrode contact layer, an N type InSb layer, a P type epitaxial Si layer and an N+ type Si layer which are stacked from top to bottom, wherein the N type InSb layer is taken as an absorption layer, the Ptype epitaxial Si layer is taken as a multiplication layer, and the N type InSb layer and the P type epitaxial Si layer are an N type InSb layer and a P type epitaxial Si layer in an InSb / Si bonded wafer respectively. Therefore, absorption of InSb on infrared band lights is high, difference between electron ionization rate and hole ionization rate of an epitaxial Si material is relatively large, an excess noise factor of the epitaxial Si material is small, and multiplication performance with lower noise can be obtained; compared with the circumstance that the multiplication layer is InSb, noise of an InSb / Si APD device can be lowered, responsibility of an APD detector is improved, and high-speed and low-noise photoelectric detection effect can be realized by virtue of combination of the Ntype InSb layer as a relatively narrow absorption layer and the P type epitaxial Si layer as a narrow multiplication layer; meanwhile, the InSb / Si bonding wafer is used, so that thermal mismatch witha Si reading circuit is reduced.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Method for realizing infrared photoelectric detection by regulating and controlling metal/semiconductor Schottky junction through pyroelectric effect of polar semiconductor

The invention relates to a method for realizing infrared photoelectric detection by regulating and controlling a metal/semiconductor Schottky junction through a pyroelectric effect of a polar semiconductor. A metal electrode is prepared on the surface of a polar semiconductor material, a Schottky junction is formed on the surface of a semiconductor, ultraviolet light is utilized to excite free electrons to improve infrared light absorption of the semiconductor, infrared light is utilized to excite a pyroelectric field of the polar semiconductor, and the pyroelectric field is utilized to regulate and control the junction height of the Schottky junction of a heterogeneous interface to regulate and control a light current. Therefore, infrared light detection is realized. The method is easy to operate and low in equipment requirement, large-area operation of the semiconductor material can be achieved, surface modification of the semiconductor material cannot reduce the light responsivity of the semiconductor material, and the method can be suitable for various semiconductor materials with polarity. According to the invention, the regulation and control effect is obvious, the responsivity of the device reaches 13mA/W, the response speed reaches 0.5 s, and the performance of the device has good stability and repeatability.
Owner:SHANDONG UNIV

Photoelectrochemistry type optical detector based on two-dimensional selenium nanosheet, and preparation method thereof

The invention provides a photoelectrochemistry type optical detector based on a two-dimensional selenium nanosheet. The photoelectrochemistry type detector comprises a working electrode, a counter electrode and electrolyte arranged between the working electrode and the counter electrode, wherein the working electrode comprises an electric conduction substrate and a semiconductor layer arranged onone side, which faces the counter electrode, of the electric conduction substrate; the material of the semiconductor layer comprises the two-dimensional selenium nanosheet. The optical detector provided by the invention has good performance. The invention also provides a preparation method for the photoelectrochemistry type optical detector based on the two-dimensional selenium nanosheet. The preparation method comprises the following steps: providing selenium raw materials, adopting a liquid phase stripping method to strip the selenium raw materials, and obtaining the two-dimensional seleniumnanosheet; dispersing the two-dimensional selenium nanosheet in solvent to form two-dimensional selenium nanosheet dispersion liquid, evenly coating the two-dimensional selenium nanosheet dispersionliquid on the electric conduction substrate, and drying to obtain the working electrode; providing the counter electrode, injecting the electrolyte between the working electrode and the counter electrode, and packaging to obtain the optical detector. The preparation method provided by the invention is simple and easy to operate.
Owner:SHENZHEN UNIV

Preparation method of flexible photoelectric detector based on selenide/sulfide heterojunction

The invention discloses a flexible photoelectric detector based on a selenide/sulfide heterojunction and a preparation method thereof. The sensor adopts a PI film as a substrate, ITO as an electrode, and a heterojunction formed by a P-type selenide with a forbidden band width of 1.2-2.4 eV (such as GaSe with a forbidden band width of about 2.1 eV) and an n-type sulfide with a forbidden band width of 1.8-2.2 eV (such as MoS2 with a forbidden band width of about 1.8 eV) as a functional layer. The preparation method of the flexible photoelectric detector comprises the following steps: firstly, acquiring an ITO electrode through a photoetching technology and ITO wet etching, then acquiring a submicron slice of selenide and sulfide by adopting a mechanical stripping mode, accurately aligning the submicron slice with the ITO electrode, and transferring the submicron slice to the ITO electrode based on a PI substrate to form an ultrathin two-dimensional semiconductor heterojunction (wherein the thickness of each layer is in a range of 10 nm to 30 nm) with an area of a junction region being in a range of 1*10<2> to 2.5*10<3> square microns. The preparation method is convenient, environment-friendly and cheap; the selenide/sulfide heterojunction photoelectric detector prepared based on the method has good bendability, can be applied to more scenes compared with a rigid photoelectric detector, and can be applied to more fields due to the material characteristics of the selenide/sulfide heterojunction; and the photoelectric detector has good photoelectric detection performance and can achieve good photoelectric detection effect.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Thin film uniform deposition and high-precision patterning method based on liquid-phase MXene material and large-scale preparation method of photoelectric device

The invention relates to the field of research, development and application of a novel MXene-based photoelectric detector, in particular to a method for uniformly depositing a thin film based on a liquid-phase MXene material, high-precision patterning and preparing a photoelectric device on a large scale. The method comprises the following steps: spin-coating an MXene material suspension through a spin coater, and preparing a uniform MXene material film on a silicon wafer; and realizing the high-precision patterning of the MXene material thin film by adopting a photoetching-dry etching process. The MXene-based photoelectric detector is composed of a silicon substrate, an electrode, a semiconductor layer, a transparent conductive film layer and the like, the electrode, the semiconductor layer, the transparent conductive film layer and the like are arranged on the silicon substrate, the semiconductor layer is made of n-type silicon formed by doping, the transparent conductive film layer is made of MXene materials, and the electrode is formed by compounding a Ti layer and an Au layer. According to the invention, the patterning of the large-area MXene material film is realized by using a photoetching-dry etching process, so that the high-resolution MXene-based photoelectric detector is constructed, and the MXene-based photoelectric detector has good photoelectric performance and long cycle life.
Owner:INST OF METAL RESEARCH - CHINESE ACAD OF SCI

Light modulation thin film transistor based on quantum dot doped gate insulating layer

The invention discloses a novel high-performance light modulation thin film transistor based on a quantum dot doped gate insulating layer. A preparation method thereof comprises the following steps: depositing an active layer and a source and drain electrode contact layer on a base in sequence; spinning quantum dots and organic optical cement on the active layer to prepare the gate insulating layer; etching via holes for connecting the contact layer with active and drain electrodes on the gate insulating layer; and finally preparing a transparent electrode on the gate insulating layer, and etching the transparent electrode as the drain electrode, gate electrode and source electrode of a plane. Besides the three modulation electrodes of a traditional source and drain gate, the thin film transistor device disclosed by the invention can be taken as a fourth end modulation electrode through incident light. The light modulation thin film transistor with photoelectric detection and signal read functions is prepared by using the thin film transistor gate insulating layer doped with the quantum dots, so that the structure and preparation technology of the light modulation thin film transistor are greatly simplified, the dimensions of the device are shortened, and the photoelectric detection performance is improved.
Owner:SOUTHEAST UNIV

2D ga1- x in x se alloy and its preparation method and its application in the preparation of photoelectric detection

The invention discloses a two-dimensional Ca<1-x>InxSe alloy, a preparation method thereof and an application in the preparation of photoelectric detection, and belongs to the field of material preparation technologies and high-performance visible-near infrared photoelectric detectors. The preparation method of the alloy comprises the steps of putting selenium powder and an indium-gallium eutecticalloy into a quartz boat, vacuumizing, carrying out heat preservation after heating, and cooling to obtain a bulk alloy material; carrying out preprocessing on an SiO2 / Si substrate; bonding the bulkalloy material by a transparent adhesive tape, then pasting the transparent adhesive tape on the processed substrate, soaking the substrate in acetone, and taking out the substrate to obtain the randomly distributed two-dimensional Ca<1-x>InxSe alloy on the surface. The prepared two-dimensional alloy is used for preparing a photoelectric detector. The current is significantly increased under visible-near infrared light irradiation. The alloy has excellent photoelectric detection performance, and the optical response value (strain coefficient) reaches up to 258A / W which is 92 times of the optical response value of GaSe.
Owner:NORTHEAST FORESTRY UNIVERSITY
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