This invention relates to a high-efficiency
polishing slurry for
silicon wafers using a synergistic silica
sol, which is mainly composed of the following raw materials in the indicated weight ratios: 10-30 parts silica
abrasive; 0.001-0.5 parts
nitrogen-containing functional group
promoter; 0.01-1 part surfactant; 0.1-5 parts acid-base adjuster; and 30-90 parts water. This
polishing slurry, through the synergistic effect of the compound design of amino silica
sol raw materials and the
interfacial reaction regulation mechanism of the
nitrogen-containing functional group
promoter, effectively improves the
material removal rate, significantly improves
polishing uniformity, inhibits local over-
corrosion and particle agglomeration, reduces
surface roughness, and simultaneously reduces particle residue and
metal ion contamination. It achieves a synergistic balance between high efficiency and low damage, meeting the performance requirements of polishing slurries for precision
machining of high-end single-
crystal silicon wafers.