The invention discloses a
semiconductor structure and a forming method thereof. The method comprises the following steps: providing a substrate, and
etching a first surface of the substrate to form a plurality of grooves; sequentially forming a
lower pole plate, a
dielectric layer and an upper pole plate of the trench
capacitor in the trench; a first through hole conductive structure is formed above at least part of the grooves, and the first through hole conductive structure is electrically connected to the
lower pole plate in the groove below the first through hole conductive structure and is electrically connected with the
metal wire located on the second face of the substrate through the
lower pole plate; the first through hole conductive structure and the second through hole conductive structure used for being connected with an upper
electrode plate of the groove
capacitor can be synchronously formed, and plane capacitors can be prepared in parallel while the groove
capacitor is formed. According to the invention, through pre-forming and embedding the through hole conductive structure in the groove
etching and capacitor
preparation stage, the
etching depth required by the subsequent top layer through hole can be obviously shortened, the high
aspect ratio etching difficulty and the side wall damage risk are reduced, the
metal filling is improved, and the
interconnection alignment tolerance and yield are improved; and meanwhile, the method is compatible with the existing
planar capacitor and rear-end
interconnection process, and is beneficial to the reliability and the process stability of the device.