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4results about How to "Efficient production capacity" patented technology

Method for synthesizing gem-difluoroolefin compound through conversion of alkane under catalysis of acridine

The invention discloses a method for synthesizing a gem-difluoroolefin compound through conversion of alkane under catalysis of acridine. The gem-difluoroolefin is a multifunctional fluorine-containing synthon and is a core unit structure for improving performance in the fields of medicines, pesticides and materials. According to the method, an alpha-trifluoroolefin compound and various alkanes are taken as raw materials, and gem-difluoroallylation is directly realized under the conditions of acridine, alkali and illumination. The method has the advantages of simple preparation operation and wide substrate applicability, and contains various electron-withdrawing or electron-donating groups and various cyclic heterocyclic or non-heterocyclic alkanes. The method is mild in reaction condition, relatively high in yield and simple in subsequent treatment, and is a green chemical synthesis method with a relatively good application prospect.
Owner:NANJING FORESTRY UNIV

A composite double-well fire flooding method for low permeability difference oil layer

ActiveCN117266814BDifficult to handleRaise the level of developmentSoil scienceWell placement
A composite double well fire flooding method for low permeability difference oil layer belongs to the technical field of artificial auxiliary viscosity reduction technology in tertiary oil recovery process. The composite double well low permeability reservoir development process is as follows: two wells are drilled at all well sites in the oil production core area, one is a composite oil production well, and the other is a fire flooding air injection well. All the drilled wells at the outer edge of the reservoir are single oil production wells. The fire flooding air injection well in the well pattern supplements the high production layer and is ignited by physical and chemical methods. Any oil production well in the well pattern cannot supplement the fire flooding layer. The present application has the following characteristics: the composite double well fire flooding technology absorbs the advantages of steam huff and puff development, steam flooding, fire flooding and other development methods, has low cost, good effect, reduces labor intensity and saves human resources.
Owner:PETROCHINA CO LTD

A method for synthesizing a 4,6-bis(trifluoromethyl)-1,3,5-triazabicyclo[3.1.0]hex-2-ene compound

This invention discloses a method for synthesizing 4,6-bis(trifluoromethyl)-1,3,5-triazabicyclo[3.1.0]hex-2-ene compounds. Using nitrile compounds and diacaridine as raw materials, the method utilizes photo-induced decomposition of diacaridine to efficiently construct the target azabicyclo skeleton. This method features mild reaction conditions and a simple synthetic route. Furthermore, it exhibits broad functional tolerance, mild reaction conditions, high yield, and simple post-processing, making it a promising green chemical synthesis method. The novel skeleton can serve as a novel bioisostere, overcoming the bottlenecks of limited existing skeleton structures and high synthetic difficulty, providing technical support for drug molecule optimization and new drug development.
Owner:NANJING FORESTRY UNIV

A wafer grinding method and the ground wafer

This invention discloses a wafer polishing method and a polished wafer. The polishing method sequentially includes a first polishing, a second polishing, a third polishing, a fourth polishing, and a fifth polishing. The first, second, third, and fourth polishing steps polish the metal film on the wafer surface. After the fourth polishing, all the metal film on the wafer surface is polished. The polished thickness satisfies the following conditions: T0 = 2 × T1 - T2 - 0.2; T1 = 0.7 × T0 - 0.2; T2 = 4 × T3 - 0.4; where T0 is the initial thickness of the metal film on the wafer surface, T1 is the remaining metal film thickness after the first polishing, T2 is the remaining metal film thickness after the second polishing, and T3 is the remaining metal film thickness after the third polishing. This invention employs a five-step polishing process, where the first four steps polish the metal film on the wafer surface to a specific thickness, ultimately improving polishing efficiency and simultaneously improving surface defects on the wafer.
Owner:BEIJING SEMICORE MICROELECTRONICS EQUIPMENT CO LTD