The invention discloses a method for quickly detecting the thickness of a large-area
adhesive layer, which comprises the following steps of:
cutting a
chip wafer into independent core particles, uniformly sampling, measuring the electrical property of the sampled core particles, removing the core particles with abnormal electrical property, performing probing operation on the core particles with normal electrical property by using a thimble, measuring the electrical property of the probed core particles, and detecting the thickness of the large-area
adhesive layer. The method comprises the following steps: calculating the electric
leakage rate based on the number of core particles with undamaged electrical properties or electric leakage, randomly extracting parts from the core particles after probing, measuring the thickness of a bonding
adhesive layer, establishing an equivalent relation comparison table of the electric
leakage rate and the thickness of the adhesive layer, calculating the electric
leakage rate of a
chip wafer to be detected, and searching the equivalent thickness of the adhesive layer according to the comparison table. According to the method, after the device is processed in a
damage detection mode, the electrical property of the device is measured to equivalently represent the thickness of the adhesive layer, the adhesive thickness level of the whole
wafer can be rapidly evaluated, no requirement is made for the appearance and
light transmission of a product, and meanwhile the recognition precision can reach the submicron level.