78results about How to "Improve metal performance" patented technology

A metal gasket in which a thin metal plate for reinforcing the beads of an elastic metal plate is laminated on bead regions only of the elastic metal plate, whereby a stable sealing performance is secured for a long period of time. This metal gasket comprises a thin metal plate provided with beads extending around the circumferences of parallel arranged combustion chamber holes, and an elastic metal plate having combustion chamber holes and extending with a predetermined width and laminated on the portions of the thin metal plate which are around the combustion chamber holes so as to be opposed to valley portions of the beads. The thickness of the thin metal plate is set smaller than that of the elastic metal plate. The thin metal plate is fixed to the elastic metal plate with locking portions formed at the outer circumference of the former engaged with slits formed in the regions of the latter which are on the outer sides of the beads, the thin metal plate being combined with the elastic metal plate at joint portions thereof by spot welding or laser welding.

A fabricating method of semiconductor structure is provided. First, a substrate with a dielectric layer formed thereon is provided. The dielectric layer has a first opening and a second opening exposing a portion of the substrate. Further, a gate dielectric layer including a high-k dielectric layer and a barrier layer stacked thereon had been formed on the bottoms of the first opening and the second opening. Next, a sacrificial layer is formed on the portion of the gate dielectric layer within the second opening. Next, a first work function metal layer is formed to cover the portion of the gate dielectric layer within the first opening and the sacrificial layer. Then, the portion of the first work function metal layer and the sacrificial layer within the second opening are removed.

A package substrate for improving electrical performance includes at least an insulating layer, a wiring layer and a ground/power layer. The wiring layer is formed on a top surface of the insulating layer, and includes a plurality of inner fingers, a plurality of outer fingers and a metal ring. A plurality of inner through holes are formed through the insulating layer to electrically connect corresponding inner fingers to bottom surface of the insulating layer. The ground/power layer has a plurality of openings formed on a bottom surface of the insulating layer. The plurality of inner through holes are crowded in groups to pass through the openings which are electrically isolated from the ground/power layer. Each group of the inner through holes are arranged in grid array or radial arrangement so that a distance between two adjacent openings not less than 0.2 mm for improving electrical performance of the ground/power layer.

A method is used to provide a toner image with a metallic effect. After forming a latent image, it is developed with metallic dry toner particles to form a developed toner image that is transferred and fixed to a receiver material. Each metallic dry toner particle consists essentially of a polymeric binder phase and non-conductive metal oxide particles. Before fixing, the metallic dry toner particle has a mean volume weighted diameter (D_vol) of at least 15 μm and up to and including 40 μm. The non-conductive metal oxide particles are present in an amount of 20-50 weight %. The ratio of the metallic dry toner particle D_vol to the average equivalent circular diameter (ECD) of the non-conductive metal oxide particles in the metallic dry toner particles, before fixing, is greater than 0.1 and up to and including 10.

Aspects of the present invention relate to approaches for forming a semiconductor device such as a field-effect-transistor (FET) having a metal gate with improved performance. A metal gate is formed on a substrate in the semiconductor device. Further processing can result in unwanted oxidation in the metal that forms the metal gate. A reducing agent can be used to de-oxidize the metal that forms the metal gate, leaving a substantially non-oxidized surface.

A metal halide lamp comprises a refractory, light-transmitting airtight container defining therein a discharge space with an internal volume of not more than 0.1 cc, electrodes sealed in the container, opposing each other with a distance of not more than 5 mm interposed, and a discharge medium sealed in the container and including a metal halide material and a rare gas. The metal halide includes first and second halide materials. The first halide material contains scandium (Sc) and sodium (Na) halides. The second halide material contains at least one of indium (In) and zinc (Zn) halides. The discharge medium contains substantially no mercury. The load on the wall of the container in a stable state is 50 W/cm² or more. A/B≦0.21 where A represents the intensity of an impurity chromium (Cr) spectrum in lighting spectra, and B represents the intensity of a scandium (Sc) spectrum.

PCT No. PCT/JP97/04289 Sec. 371 Date Jun. 24, 1998 Sec. 102(e) Date Jun. 24, 1998 PCT Filed Nov. 25, 1997 PCT Pub. No. WO98/24942 PCT Pub. Date Jun. 11, 1998A steel sheet for double-rolled tubes has excellent formability, and excellent strength and toughness after forming and heat treatment of a tube because of suppressed coarsening of the ferrite grain size and a method for making the same comprises: hot finish-rolling of a steel material containing C: 0.0005-0.020 wt %, and one or two of Nb: 0.003-0.040 wt %, and Ti: 0.005-0.060 wt % at a final temperature of 1,000-850 DEG C., coiling at 750 DEG C. or less, cold rolling, continuous annealing at 650 DEG C.-850 DEG C. for 20 seconds or less, and second cold-rolling at a rolling reduction rate of 20% or less, so that at least one of Nb and Ti is present in a solid solution state in an amount of 0.005 wt % or more, and the crystal grain size in the ferrite structure is in the range of 5 to 10 mu m.

Various embodiments provide metal gate transistors and methods for forming the same. In an exemplary method, a substrate having a top surface and a back surface can be provided. A dummy gate can be formed on the top surface. A first interlayer dielectric layer can be formed on the top surface and planarized to expose the dummy gate. The dummy gate can be removed to form a trench. A metal gate stack can be formed to cover the first interlayer dielectric layer and to fill the trench. The metal gate stack can be planarized to remove a portion of the metal gate stack from the first interlayer dielectric layer to form a metal gate electrode in the trench. A remaining edge portion of the metal gate stack can exist over an annular region of the substrate and can be removed from the annular region by an edge cleaning process.

Metallic dry toner particles are prepared by dry blending resin particles with non-conductive metal oxide particles to form a dry blend. This dry blend is melt extruded under low shear conditions to form an extruded composition that is broken up into metallic dry toner particles. Each metallic dry toner particle consists essentially of a polymeric binder phase formed from the resin particles, and the non-conductive metal oxide particles dispersed within the polymeric binder phase. The metallic dry toner particles have a mean volume weighted diameter (D_vol) before fixing of 15 μm to 40 μm, and the non-conductive metal oxide particles are present in an amount of 20 to 50 weight %. The ratio of the metallic dry toner particle D_volto the average equivalent circular diameter (ECD) of the non-conductive metal oxide particles in the metallic dry toner particles is greater than 0.1 and to 10.

The invention discloses a cable connecting component and a method of connecting cables with rails by using the same. The cable connecting component comprises a tapered bolt of which the head is connected with a track circuit cable and of which a shaft is provided with a cone part with a gradually reduced diameter from the head to the shaft; the cable connecting component also comprises a flexible sheath inserted on a rail web and a taper hole which can accommodate the cone part is arranged on the inner wall of the flexible sheath; one end t of the shaft of the tapered bolt far away from the head is through an inner hole of the flexible sheath, the outer wall of the cone part is held against the inner wall of the taper hole tightly, and the end of the shaft of the tapered bolt far away from the head is also locked with a nut. The cable connecting component and the method enable the tapered bolt, the flexible sheath and the end face of the rail web to stick tightly without gaps, which ensure that the cable connecting component can keep stable metallic performance and be not easy to rust during the long-term application.

A method and apparatus for nanocrystallizing a metal surface by laser-induced shock wave-accelerated nanoparticles. The apparatus comprises a control system, a light guiding system, a workbench control system and an auxiliary system, wherein the auxiliary system comprises an air compressor, a paint feeder device, a nanoparticle nozzle, a powder feeder device, an exhaust, a sealed working chamber and a metal nanoparticle recycler device. The method comprises the following steps: pre-processing and fixing a workpiece; activating the air compressor to feed a powder; controlling and adjusting the paint feeder device to eject a black paint; transmitting a high-power pulse laser beam; recycling excess metal nanoparticles; and rinsing non-vaporized/ionized black paint off a surface of the workpiece.

The invention relates to a dual-powder mixing printing system for 3D printing. For an existing 3D printing system, a powder A cylinder (4) and a powder B cylinder (5) are arranged at the two sides ofa forming cylinder (3) in a sealing box (1) respectively, in cooperation with scraper systems designed for the powder cylinders respectively, on the basis of a laser device (2), alternate 3D printingbetween two kinds of powder is achieved, meanwhile, a powder A collecting cylinder (6) is introduced at the position between the powder A cylinder (4) and the forming cylinder (3), and a powder B collecting cylinder (7) is introduced at the position between the powder B cylinder (5) and the forming cylinder (3), the powder in the corresponding powder cylinders is scraped into the forming cylinder(3) through scrapers (12) in the scraper systems, and then surplus powder is scraped into the corresponding powder collecting cylinders; the surplus powder can be recycled, the powder obtained after layers of 3D printing is not mixed, the powder can be used secondarily, the advantages of the two kinds of powder are achieved, and the metal performance of forming materials is effectively improved.

The invention relates to a high-temperature-resistant high-metal-effect plastic paint and a preparation method thereof. The preparation method comprises the following steps: sequentially adding 20-30 wt% of acrylic resin A, 20-35 wt% of acrylic resin B, 10-20 wt% of polyester resin, 2-3 wt% of catalyst, 0.2-1.0 wt% of acrylic leveling agent, 0.2-0.8 wt% of organic silicon leveling agent, 0.5-1.0 wt% of weather-resistant assistant and 15-25 wt% of mixed solvent, slowly stirring, and stirring at the high speed of 600-800 rpm for 15 minutes to obtain the high-temperature-resistant high-metal-effect plastic paint. Compared with the prior art, the method enhances the high temperature resistance, high metal effect, wear resistance and other properties of the plastic paint.

The invention discloses easy-to-cut titanium alloy, which comprises the following components in percentage by weight: 3 percent to 6.1 percent of chromium, 1 percent to 4 percent of manganese, 5.1 percent to 8 percent of aluminum, 0.4 percent to 1.3 percent of silicon, 3.7 percent to 7 percent of magnesium, 1.3 percent to 2.7 percent of lead, and the balance titanium. According to the easy-to-cut titanium alloy provided by the invention, the manganese, the aluminum, a small amount of lead and other metals are added, a vacuum consumable-electrode arc melting technology is adopted for melting for three times repeatedly, and degassing, deoxidizing and impurity removing processes are better realized for the metal materials, so that a pure metal material billet is acquired; due to high melting rate and the accurate control of an electric arc heating area, the consistency of a melting metal solidification direction is ensured, a metal performance of the material is greatly improved, and the titanium alloy can be easily cut; and later, double annealing is carried out, so that recrystallization is fully carried out without increasing crystal particles in the titanium alloy, the plasticity and the structure stability of the titanium alloy are improved, the machinability of the titanium alloy is improved, and meanwhile, the high strength and the stability of the titanium alloy are further maintained.

The invention belongs to the technical field of ceramic glaze, and relates to metal glaze as well as a preparation method and an application method thereof. The metal glaze comprises the following raw materials in percentage by weight: 30-37% of albite, 8-15% of quartz, 0-4% of wollastonite, 9-16% of calcined kaolin, 4-6% of calcined zinc oxide, 19-23% of calcined iron phosphate and 13-20% of self-made high-phosphorus frit powder. On the basis of calcined iron phosphate, self-made high-phosphorus frit powder is added as a crystallization accelerant into the metal glaze, so that the metal luster is more easily presented. The element P is introduced into the self-made high-phosphorus frit powder in a frit form, and compared with a high-phosphorus raw material system, the self-made high-phosphorus frit powder has a wider firing temperature range, and the metal effect is more stably presented. By finely adjusting the ratio of the self-made high-phosphorus frit powder to the silicon-aluminum of the metal glaze, the adjustment of metal to different colors can be realized. In addition, the metal glaze is combined with a roller printing process, so that the glaze surface can present a good three-dimensional effect.

The invention discloses to a production process of a thin-wall boosting extruded tube and thin-wall boosting extruded tube, and belongs to the technical field of food processing equipment. The production process comprises the steps that after a high-quality pipe is selected and cut, a pipe blank with a boosting groove is formed in a bulging mode through a water swelling process, and then an annular pipe of an integrated structure used for welding a feeding pipe is drawn out; compared with a traditional metal casting process, a thin-wall boosting extrusion pipe manufactured through the production process has the advantages that the thickness of a pipe wall is greatly reduced, the thin-wall boosting extrusion pipe is light in weight, the energy consumption of the production process is low, the production cost is low, the process steps are simple, the production period is shortened, the production efficiency is improved, and the production cost is reduced, and continuous production can be realized.

The invention provides a preparation method of a CuCrZr alloy material self-operated contact finger product. The preparation method comprises the following steps: S1, taking raw materials including achromium block, a copper-zirconium 40 intermediate alloy, rare earth and an electrolytic copper plate for later use; S2, smelting the raw materials in a vacuum medium-frequency induction furnace, andobtaining a uniform alloy solution; S3, refining the alloy solution obtained in the S2, degassed and deoxidized and then introducing the solution into a mold for cooling crystallization, and obtainingan alloy ingot after demolding; S4, the alloy ingot obtained in S3 being subjected to extrusion, solution treatment, multi-pass drawing and aging treatment, and obtaining a treated profile; S5, conducting blanking, punching, bending and groove milling on the profile obtained in the S4, and obtaining a contact finger; and S6, performing surface deburring and overall shape correction on the contactfinger obtained in the step S5, and plating a nano-silver layer on the electric contact surface of the contact finger to obtain a self-operated contact finger product with the electric conductivity of greater than 85% IACS, the hardness HB of greater than 155 and the tensile strength of greater than 480MPa.