This invention discloses a method for manufacturing high-precision fine-line printed circuit boards, belonging to the technical field of
printed circuit board manufacturing. The method includes:
substrate surface treatment; high-precision
screen printing pattern transfer, achieving a printing accuracy of ±10μm through a high-tension stainless steel screen, nano-modified anti-
etching ink, and a high-precision vision alignment
system; post-curing treatment to form an etch-resistant protective layer; segmented
etching process with an
etching factor of 8 or higher; ink removal and post-
processing. This invention innovatively applies
screen printing technology to the transfer of fine-line patterns. Through systematic optimization of screen production, ink formulation, printing parameters, and etching processes, it breaks through the precision limitations of traditional
screen printing technology, enabling stable manufacturing of fine lines of 0.25mm / 0.25mm and below, effectively solving the open /
short circuit problem caused by side etching, achieving a
yield rate of over 98%, and significantly reducing production costs. This method is suitable for the
mass production of rigid, flexible, and rigid-flex PCBs.