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49results about How to "Less peeling" patented technology

Method for detecting biochemical oxygen demand

The present invention provides a method for detecting biochemical oxygen demand. Active sludge, surface water, domestic waste water, or industrial waste water comprising microorganism is taken as a water sample with microorganism in the method provided by the present invention. The water sample with microorganism is cultivated to obtain a microorganism film. The blank water sample and the target water sample are made to pass through the microorganism film respectively. The dissolved oxygen reduction current values of the blank water sample and the target water sample are detected. The difference value between the dissolved oxygen reduction current value of the target water sample and that of the blank water sample is obtained. On the basis of the difference value and the predetermined standard curve, the biochemical oxygen demand of the target water sample is acquired. The method provided by the present invention adopts active sludge, surface water, domestic waste water, or industrial waste water comprising microorganism as the water sample with microorganism. The environmental adaptability of the prepared microorganism film is strong, so that one or more of tap water, well water, atmospheric water, or ground water may serve as medium to maintain the physiological activity with no need of providing a buffer solution system.
Owner:CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI

Surface-treated copper foil, manufacturing method of the surface-treated copper foil, and surface-treated copper foil coated with very thin primer resin layer

InactiveUS20090029186A1Less peel lossGood solder blisterPretreated surfacesRecord information storageChromium freeChemical treatment
It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. To achieve this object, a surface-treated copper foil comprising an rust-proofing layer and a silane coupling agent layer formed on the bonding surface of an electrodeposited copper foil to an insulating resin substrate, wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the rust-proofing layer is provided with the silane coupling layer on the surface is applied. Also a surface-treated copper foil coated with a very thin primer resin layer, comprising the surface-treated copper foil according to the present invention (without roughening treatment), and a very thin primer resin layer having a thickness by calculation of 0.5 to 5-micron meter provided on the bonding surface of the surface-treated copper foil to the insulating resin substrate is applied.
Owner:MITSUI MINING & SMELTING CO LTD
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