The invention discloses a
copper electroplating additive and a preparation method of the
copper electroplating additive. The
copper electroplating additive is prepared from, by weight, 5-10kg of 50%
sulfuric acid, 1-5kg of
copper sulfate, 1-6kg of bis-(
sodium sulfopropyl)-disulfide, 1-6kg of
propane pyridinium sulfonate salt, 1-5kg of
alkyl dimethyl
ammonium chloride and
sulfur dioxide polymerizedquaternary
ammonium salt, 80-150kg of polyoxycyclohexane-
polypropylene oxide monobutyl
ether and 1-8kg of PEG. The preparation method comprises the specific steps that 1.1, about 85 L of pure water is added, and stirring is started; 1.2,
sulfuric acid is added and stirred till being completely dissolved; 1.3,
copper sulfate is added and stirred till being completely dissolved; 1.4, bis-(
sodium sulfopropyl)-disulfide is added and stirred till being completely dissolved; 1.5,
propane pyridinium sulfonate salt is added and stirred till being completely dissolved; 1.6,
alkyl dimethyl
ammonium chloride and
sulfur dioxide polymerized
quaternary ammonium salt are added and stirred till being completely dissolved; 1.7, polyoxycyclohexane-
polypropylene oxide monobutyl
ether is added and stirred till being completely dissolved; and 1.8, PEG8000 is added and stirred till being completely dissolved. Brightness of an electroplated copper layer can be ensured, plate burning is prevented,
anode slime is reduced, and the electroplating Tp value is high.