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4results about How to "Cause mechanical damage" patented technology

Method for selectively removing transparent coating on surface of workpiece through laser scanning

The invention discloses a method for selectively removing a transparent coating on the surface of a workpiece through laser scanning, which comprises the following steps of: firstly, covering the transparent coating on the surface of the workpiece with a transparent flexible film, filling photosensitive glue between the transparent flexible film and the workpiece, and then curing the photosensitive glue on a custom pattern part by using ultraviolet laser to penetrate through the transparent flexible film to obtain the transparent coating on the surface of the workpiece. Then infrared laser is used for heating the cured photosensitive adhesive layer, so that heat is conducted to the transparent coating, the transparent coating is softened, the photosensitive adhesive layer and the transparent coating are further glued, finally, the transparent flexible film is stripped, and the transparent coating of the user-defined pattern part is removed. According to the method, the transparent coating on the surface of the workpiece is rapidly, accurately and selectively removed, the surface of the workpiece is not damaged, and the method is convenient, rapid, high in safety, environmentally friendly and free of pollution.
Owner:ZHEJIANG MOKE LASER INTELLIGENT EQUIP CO LTD

A local covering and adjusting packaging device for a matte film

This invention discloses an adjustable matte film partial lamination packaging processing device, belonging to the field of packaging processing technology. The device includes a fixed support frame mounted above a packaging conveyor. Two adjustable adjustable frames are movably mounted on the left and right sides of the top of the fixed support frame. Inside the adjustable frames are liftable suction frames and material support frames, enabling adaptive picking and positioning of packaging pieces of different widths. A cleaning component, a lamination component, and a cutting component are also movably mounted on the fixed support frame, which can sequentially perform cleaning, hot-press lamination, and laser cutting on the surface of the packaging pieces. This invention, through its adjustable positioning structure and multi-process structure, achieves high-precision partial lamination and cutting of matte film on packaging pieces, effectively improving processing quality and production efficiency, and is suitable for automated processing of packaging pieces of various specifications.
Owner:XIAN UNIV OF TECH

A counter breaker and a rotor locking mechanism thereof

ActiveCN224293385UCause mechanical damageGrain treatmentsClassical mechanicsMechanical engineering
The utility model discloses a counter breaker and rotor locking mechanism thereof, rotor locking mechanism includes rotor subassembly and bearing assembly, and rotor subassembly includes rotor and the turntable of being connected on rotor, is connected with the plate hammer on the turntable, and the rotor rotatable installation is in the crushing chamber of counter breaker, is provided with a circle screw hole on the rotor, bearing assembly includes bearing seat, bearing end cover with bearing seat connection and bearing body setting in bearing seat, and bearing assembly is located the crushing chamber outside of counter breaker, and is provided with arc long waist hole on bearing end cover, wherein, the detachable fixing bolt is connected between screw hole and arc long waist hole, and counter breaker includes above-mentioned rotor locking mechanism.
Owner:GUANGXI MESIDA KERUI MACHINERY EQUIPMENT CO LTD

MIM capacitor test structure and preparation and test method thereof

The invention discloses an MIM capacitor test structure and a preparation and test method thereof. The MIM capacitor test structure comprises a semiconductor substrate, a first dielectric layer, MIM structure lower layer metal, a second dielectric layer, a first isolation protection layer, a third dielectric layer, a second isolation protection layer and a passivation layer. A first conductive groove is formed in the first dielectric layer, the MIM structure lower-layer metal and the second dielectric layer, and a groove side wall dielectric layer, a first conductive groove barrier layer and the MIM structure upper-layer metal are arranged in the first conductive groove; the passivation layer wraps the MIM capacitor structure and protects the MIM capacitor structure from being eroded by environmental factors such as water vapor, an electrode detection position far away from a core research area is provided, and it is ensured that mechanical damage cannot be caused to the side wall of the groove.
Owner:ZHEJIANG UNIV +1