The embodiment of the application provides a
wafer horizontal cleaning device, which comprises a clamping disc, a power
assembly and a back spraying
assembly. The clamping disc is used for horizontally clamping a
wafer, and a cleaning hole is arranged in a
central region of the clamping disc. The power
assembly is arranged below the clamping disc, an end of an output shaft of the power assembly penetrates the cleaning hole, the output shaft is a hollow
pipe and is in communication with the cleaning hole. The back spraying assembly is arranged in the output shaft, the back spraying assembly sprays cleaning liquid towards a back
central region of the
wafer, a first gap is formed between an outer circumferential surface of the back spraying assembly and an inner wall surface of the output shaft, the first gap is in communication with the cleaning hole, and waste liquid is discharged through the first gap. According to the wafer horizontal cleaning device, the waste liquid can be discharged through the first gap in time, the waste liquid can be effectively prevented from corroding other structural members, and the waste liquid can be prevented from being accumulated to cause liquid beads to be condensed on the back of the wafer, thereby affecting the process effect.