The invention provides a cyanide-free gold plating technology after nickel plating and priming of an electronic component. The cyanide-free gold plating technology comprises the following steps of: taking the electronic component, soaking in hydrochloric acid, cleaning, carrying out chemical polishing, cleaning, neutralizing, clamping, cleaning and removing oil; activating, and cleaning with deionized water; carrying out impact nickel plating, wherein the impact nickel plating temperature is (10-30) DEG C, and the current density is (1-8) A/dm2; carrying out nickel electroplating, wherein thenickel electroplating temperature is (40-55) DEG C, and the current density is (0.1-1) A/dm2; recycling, cleaning with deionized water, and activating; carrying out gold plating (putting into a tank with electricity), wherein the gold plating temperature is (38-45) DEG C, and the current density is (0.1-0.3 ) A/dm2; recycling, cleaning with deionized water, unloading a clamp, dewatering, and drying; and carrying out heat treatment and after treatment. According to the technology, a gold-plating layer on a nickel-plating layer has good bonding force and good coating performance.