50results about How to "Reduce the concentration of metal ions" patented technology

The invention provides a catalyst for synthesizing a polyethylene oxide polymer. The catalyst comprises a component 1, a component 2 and a component 3. The component 1 is a crown ether. The component2 is a quaternary phosphonium salt. The component 3 is an alkali metal and / or an alkali metal compound. The catalyst can reduce an alkali metal ionic concentration of the product, improve product quality and is suitable for the high standard industrial field. The invention also provides a method for synthesizing the polyethylene oxide polymer. The method comprises mixing an active hydrogen-containing compound and the catalyst, adding ethylene oxide into the mixture in an oxygen-free environment or in a vacuum environment, controlling a temperature in a range of 100-180 DEG C and pressure lessthan or equal to 1.0MPa, keeping the conditions for 1-8h to obtain the reaction product containing the polyethylene oxide-containing polymer and adding an acidic compound for neutralization into the reaction product. The method is easy to operate, is environmentally friendly, improves product quality and is suitable for high-standard industrial production.

The purpose of the present invention is to provide a method for using a metal ion solution of low concentration to efficiently form a metal film pattern of excellent accuracy and reliable adhesion on a resin substrate. A resin substrate having a metal film pattern formed thereon is produced by a method that includes the following steps (a) to (e): (a) a step for pattern-printing of a latent image agent (2) onto the surface of a resin substrate (1) ; (b) a step for bringing the area imprinted with the latent image agent (2) into contact with a solution containing metal ions, and forming a metal salt (3); (c) a step for bringing the metal salt (3) into contact with an acidic treatment liquid containing a reducing agent, and reducing the metal salt; (d) a step for forming an electroless nickel plating film (5) on the area imprinted with the latent image agent; and (e) a step for precipitating an electroless copper plating (6) onto the surface of the nickel plating film (5).

Provided is a method for producing acetic acid that is capable of greatly improving the life of a silver-substituted ion exchange resin (IER) for removing organic iodine compounds in acetic acid.With the method for producing acetic acid according to the present invention, in a carbonylation process of a methanol method, a nickel base alloy or zirconium is used as a material of a distillation column in a dehydration step, and as metal ion concentrations in a charging mixture of the distillation column in the dehydration step, an iron ion concentration is less than 10,000 ppb by mass, a chromium ion concentration is less than 5,000 ppb by mass, a nickel ion concentration is less than 3,000 ppb by mass, and a molybdenum ion concentration is less than 2,000 ppb by mass.

A process for alkali washing of oil to remove acid, salt and metal ions features that the raw oil is washed by the alcohol solution of sodium hydroxide in a mixer which is divided into upper and lower layers by the dispersing medium. The alcohol solution of sodium hydroxide in upper layer is dispersed into microdrops by said dispersing medium and then reacts on the raw oil in lower layer. After separation, the pure oil is obtained.

An electroplating method can securely and efficiently fill a plated metal into deep high-aspect ratio vias in a bottom-up manner without producing defects in the plated metal. The electroplating method includes: immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being disposed opposite the surface of the substrate; and intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner that the supply and the stop of the plating current are repeated, and that the proportion of a current supply time during which the plating current is supplied increases with the progress of plating, thereby filling a plated metal into the vias.