According to the
gallium nitride Schottky diode and the preparation method thereof provided by the invention, the cost is effectively reduced by using the N-type
SiC substrate, and the heat dissipation performance of the device is improved by using the high
thermal conductivity of the SiC material. As the Mg-H structure in which Mg and H form a bond is formed in the P-type GaN layer, gradient activation of Mg is realized through the patterned
hydrogen diffusion barrier layer, so that the activation rate of Mg in the
electric field regulation and control region is gradually increased from the
anode metal region to the periphery. The Mg activation
doping concentration in the P-type GaN layer of the structure is distributed in a gradually-changing mode, holes in the area with the high Mg activation
doping concentration and electrons in the N-type GaN layer are compounded more, the electrons are preferentially exhausted, the
electron concentration in the N-type GaN layer is reduced from the edge of
anode metal to the two sides, resistance is increased, then the area with the large resistance is preferentially resistant to
voltage, and the resistance of the N-type GaN layer is improved. The
electric field concentration phenomenon of the
anode metal edge is effectively relieved, and the
voltage endurance capability of the device is improved.