The invention belongs to the technical field of bonding gold wire processing, in particular to a 4N bonding gold wire capable of being processed to phi 6 micrometers through wire drawing and a preparation method of the 4N bonding gold wire. The 4N bonding gold wire comprises gold and an alloy additive. The alloy additive is formed by copper, vanadium, magnesium, palladium, silver, nickel, bismuth,beryllium, cerium, zinc, yttrium, calcium, gadolinium, aluminum and lead. According to the prepared bonding gold wire, the alloy additive of the specific components and content is added, the drawingstrength of the gold wire can be improved through the alloy additive, and the radian of the bonding gold wire can be reduced; the prepared bonding gold wire has the good low and long radian through adding of the additive and the reasonable proportion while guaranteeing high strength; the prepared gold wire has good drawing strength, heat conductivity, resistance and low and long arc length; and meanwhile, axial long crystals are formed after a single-crystal continuous casting method is adopted for casting, high purity and a continuous columnar crystal structure are achieved, a transverse crystal boundary is eliminated, casting defects are avoided, and the prepared gold wire can be processed to 6 micrometers.