The invention relates to the technical field of
wafer annealing, and discloses high-temperature annealing cooling equipment for
wafer processing, which comprises a feeding box, a cooling cavity is formed in the feeding box, a feeding hole is formed in the front end surface of the feeding box and is communicated with the cooling cavity, a lifting air cylinder is vertically mounted at the lower end of the cooling cavity, and the lifting air cylinder is connected with the cooling cavity. And a lifting rod is upwards and movably arranged in the lifting air cylinder and extends into the cooling cavity. According to the high-temperature annealing cooling equipment for
wafer processing, the vacuum suction pump is designed, the annealing chamber is vacuumized, and
inert gas can enter the annealing chamber conveniently to serve as
shielding gas; air sucked by the second vacuum suction pump is injected into the annular air bag through the first air inlet
pipe, so that the annular air bag is inflated and is in full contact with the outer edge of the sealing plate, the sealing effect is enhanced, and the annealing chamber is in a sealed state; air sucked by the third vacuum suction pump is injected into the air
storage tank through the second air inlet
pipe and serves as standby air for blowing, and the energy-saving effect is achieved.