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57results about How to "Suitable for practical production applications" patented technology

Glass-based chip rewiring packaging structure and manufacturing method thereof

The invention discloses a glass-based chip rewiring packaging structure, comprising a glass substrate, a chip provided with a first bonding pad, a filling layer, a metal rewiring layer, a passivationlayer and a second bonding pad, wherein a through hole penetrating through upper and lower parts is formed in the glass substrate, the chip is disposed in the through hole, and the first bonding pad faces upward; the filling layer is filled in an arrangement gap of the through hole and the chip, extends to cover the glass substrate and an upper surface of the chip, and is open corresponding to thearea of the first bonding pad; the metal rewiring layer is disposed on the filling layer and is connected with the first bonding pad; the passivation layer is disposed on the metal rewiring layer andis provided with an opening; and the second bonding pad is disposed on the passivation layer and is connected with the metal rewiring layer. The invention also discloses a manufacturing method thereof. The chip rewiring structure disclosed by the invention is compact, ultra-thin packaging can be realized, meanwhile glass is used as the main material, thereby being more suitable for high-frequency devices and realizing better electric performance. Complicated processes of temporary bonding and debonding are avoided in the process, the reliability is excellent, and the cost is lower.
Owner:XIAMEN SKY SEMICON TECH CO LTD

Multi-chip fan-out packaging structure with cavity and manufacturing method of multi-chip fan-out packaging structure

The invention relates to a multi-chip fan-out packaging structure with a cavity and a manufacturing method of the multi-chip fan-out packaging structure. The multi-chip fan-out packaging structure comprises at least two chips, and the first surface of each chip is provided with a bonding pad and a functional region. The multi-chip fan-out packaging structure also comprises a first carrier, a second carrier, a filling layer, a metal rewiring layer, a first insulating layer, a second insulating layer and a signal port. The first carrier is connected to the first surface of the second carrier andis provided with a through hole; the chip is located in the through hole, and the second surface of the chip is connected to the first surface of the first carrier; the filling layer covers the firstcarrier and the first surface of the chip and is provided with a first opening; the first insulating layer covers the surface of the filling layer, so that the cavity is formed in the functional area, and a second opening is formed in the bonding pad; the metal rewiring layer is positioned on the upper surface of the first insulating layer and is electrically connected with the bonding pad; the second insulating layer covers the surfaces of the first insulating layer and the metal rewiring layer and is provided with a third opening; and the signal port is located at the third opening and is electrically connected with the metal rewiring layer. The structure can improve the packaging reliability, is small in size, and reduces the cost.
Owner:XIAMEN SKY SEMICON TECH CO LTD

Rat and termite resistant cable material

InactiveCN108752700AReduce the amount of antioxidantsComprehensive rodent and termite protectionPlastic/resin/waxes insulatorsMaleic anhydrideToxicity
The invention relates to the field of cables and discloses a rat and termite resistant cable material which is prepared from the following components in parts by weight: 60-80 parts of high density polyethylene, 40-60 parts of ethylene-vinyl acetate copolymer, 10-12 parts of polyethylene grafted maleic anhydride copolymer, 10-15 parts of white carbon black, 10-20 parts of plasticizer, 10-20 partsof fire retardant, 5-7 parts of stabilizer, 15-25 parts of rat and termite resistant agent and 1-3 parts of antioxidant. By adding the rat and termite resistant agent and compounding several plant extracts for expelling rats, killing termites and the like, through common effect of various principles of odour, toxicity and the like, the rat and termite resistant cable material is more comprehensivein preventing the rats and the termites and is better in effect; and meanwhile, by regulating other components and a ratio thereof of the cable material, the performance of the cable material is notlowered, and the rat and termite resistant cable material is simple in preparation technology, good in effect of a product and suitable for practical production application.
Owner:ZHEJIANG WELLSCOM PLASTIC CO LTD

Corrosion device and method for preparing two-color film layer on metal surface

ActiveCN108004580AControl changesLifting speed controllableAnodisationColor filmMetal
The invention discloses a corrosion device for preparing a two-color film layer on a metal surface. The corrosion device comprises a tank mechanism, a liquid drewing mechanism and a control mechanism,a first tank body for containing metal products communicates with the bottom of a second tank body which is pumped with corrosive liquid, an overflow sensor is arranged at the edge of the first tankbody, and the partial surface of the metal products is subjected to corrosion treatment based on a connectivity principle and an overflow control method. The invention further provides a method basedon the corrosion device; the method comprises the steps that the metal products coated with a first color film layer is placed in the first tank body, and the corrosive liquid is entered the first tank body through buffering of the second tank body; a liquid level of the first tank body rises steadily and a rising speed is controllable so as to form a flat and uniform corrosion interface; and thensecond coloring treatment is performed on the corrosion part. The obtained products have a clear color boundary and an attractive appearance, and the method based on the corrosion device is particularly suitable for the production of the two-color film layer on the surface of irregular products or mesh structure products.
Owner:DABO MEDICAL TECH CO LTD

Structure for reducing b-c junction capacitance of heterojunction bipolar transistor and manufacturing method thereof

The invention discloses a structure for reducing the b-c junction capacitance of a heterojunction bipolar transistor and a manufacturing method thereof, and the method comprises the steps: firstly coating a chip structure with a first light resistor, exposing and developing the first light resistor to form a first window, then coating a second light resistor, and forming a second window; after the line width of the first window is reduced through a miniature and backflow process, etching the passivation layer in the first window to form a first opening, after the photoresist is removed, coating the passivation layer with a third photoresist, performing exposure and development to form a second window located on the first opening, wherein the line width of the second window is larger than that of the first opening; and depositing metal in the second window and the first opening to form base metal, and removing light resistance. The base metal structure with the bottom line width smaller than the top line width is formed, the b-c junction area is reduced under the condition that the base resistance is not increased, the effect of reducing the b-c junction capacitance is achieved, and therefore the highest oscillation frequency is improved.
Owner:XIAMEN SANAN INTEGRATED CIRCUIT

Photoelectric control yarn feeding equipment

InactiveCN102477663AGuaranteed accuracyDirect detection methodKnittingYarnElectric machinery
The invention relates to photoelectric control yarn feeding equipment, which comprises a motor controlled by a control circuit, a detector and a yarn storage device driven by the motor, wherein the detector comprises a pair of transmitting device and receiving device, wherein the transmitting device is arranged at one side of the yarn storage device and faces to a scanning area provided by the surface of the yarn storage device; and the receiving device is arranged opposite to the transmitting device and is positioned at the other side of the yarn storage device. Compared with the prior art, the photoelectric control yarn feeding equipment has the beneficial effects that through the matched detection of the transmitting device and the receiving device, if yarns exist on the yarn storage device, the receiving device can not receive a signal, if yarns do not exist on the yarn storage device, the receiving device can receive the signal; the detection method is very direct and simple; the detection results are direct and clear; the control circuit connected with the receiving device can control the motor to rotate and stop only through knowing whether a signal exists at the output end of the receiving device or not; and the control circuit becomes very simple and facilitates production and manufacturing.
Owner:DALIAN ZHAOYANG SOFTWARE TECH
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