25 results about "Bound copper" patented technology

The invention discloses a roller grinding management method based on the surface quality of a copper plate strip, and aims to solve the problems that existing roller grinding depends on experience, positioning is inaccurate, and grinding is excessive or insufficient. The method comprises the following steps: collecting waveform data of copper print defects and flatness on the surface of a copper plate strip, and performing timestamp synchronous calibration with a rolling speed and a coil length counting signal of a rolling mill; constructing a roller damage reverse diagnosis mechanism, calculating a damage angle in combination with a copper printing coordinate, identifying a damage type, and calculating a wear depth; differentiated grinding work orders are generated according to different damage types, and high-precision positioning grinding is executed; and after returning to the production line, carrying out on-line real-time monitoring and off-line sample rechecking on the original damaged position, dynamically adjusting parameters and judging the grinding fit state. Precision, differentiation and closed-loop management of roller grinding are achieved, the grinding efficiency is effectively improved, the service life of the roller is effectively prolonged, the surface quality of a copper plate strip is remarkably improved, and the defect rate is reduced.

The application discloses a feeding device for flame retardant processing, and relates to the technical field of flame retardant processing feeding, which comprises a base, and a cooling feeding mechanism is arranged on the top of the base. When the application is used, the air cooler delivers cold air into the three-way pipe, and two air flows enter the central cavity and the air cavity respectively. The cold air in the air cavity enters the hollow cavity through the second communication hole and the first communication hole, exchanges heat with the cold air absorbed by the copper-based foam metal framework, and reduces the temperature of the feeding blade and the raw material. Meanwhile, the cold air in the central cavity passes through the aluminum-based silicon carbide composite layer and takes away the heat of the rotating shaft, thereby assisting in reducing the temperature of the raw material. Through the cooling feeding mechanism and the copper-based foam metal framework, the heat exchange of the cold air is strengthened, the overall strength is enhanced, the temperature is reduced, and the strength is doubled. In combination with the aluminum-based silicon carbide composite layer, the high torsional strength of the aluminum-based silicon carbide composite layer bears the torque transmission, and assists in reducing the temperature.

The invention discloses a preparation method of an in-situ nitrogen-doped graphene reinforced copper-based composite material based on external pyrolysis, and relates to the technical field of metal-based composite material preparation. The method specifically comprises the following steps that copper powder is placed in a heating device, and a solid nitrogen-containing carbon source is placed in an external pyrolysis device; after the system is vacuumized and cleaned, inert gas and hydrogen are introduced, and the heating device is heated to a specific temperature and is subjected to heat preservation. An external pyrolysis device is started, the temperature is increased to the pyrolysis temperature, a nitrogen-carbon-containing small molecule precursor is generated and conveyed into a heating device, in-situ growth is conducted on the surface of the copper powder, and high-dispersion composite powder is prepared; and sintering the powder to obtain the densified high-dispersion nitrogen-doped graphene / copper composite block material. According to the method, the in-situ uniform growth of the nitrogen-doped graphene on the surface of the copper powder is realized through a solid nitrogen-containing carbon source external pyrolysis technology in combination with a synergistic mechanism of copper powder regulation and control, precursor directional transportation and in-situ doping growth, and a new way is provided for controllable synthesis of the copper-based composite material.

The preparation method comprises the following steps: carrying out surface cleaning and activating treatment on a metal cooker base body, putting the cooker into PVD coating equipment, vacuumizing, configuring a titanium target, a multi-component composite target and an oxide target, cleaning the surface of the cooker by adopting ion bombardment, depositing a titanium transition layer with the thickness of 0.1-0.5 mu m, and carrying out vacuum treatment to obtain the PVD composite coating cooker. The thickness of the deposited copper-aluminum-silicon-chromium carbide composite functional layer is 4.5-5.5 microns, the thickness of the deposited oxide surface layer is 0.2-0.8 microns, and furnace cooling is carried out after film plating is completed. The three-layer gradient structure design is adopted, the titanium transition layer and the base body form metallurgical bonding, the copper-aluminum-silicon-chromium carbide composite functional layer provides hydrophobic and oleophylic performance, the oxide surface layer blocks oxygen and nitrogen diffusion, and the comprehensive performance of being high in film layer bonding force, resistant to high temperature and lasting and non-sticky is achieved.

The invention relates to the technical field of copper-clad aluminum photovoltaic welding strip processing, in particular to a continuous preparation process and device for a copper-clad aluminum photovoltaic welding strip, and the device specifically comprises a chain plate conveying table, the top of the chain plate conveying table is fixedly connected with a mounting seat, and the mounting seat is provided with an aluminum wire indentation assembly and a copper strip indentation assembly which are in linkage fit; an aluminum wire indentation assembly is combined with a copper strip indentation assembly, continuous extrusion of concave-convex traces on the surfaces of aluminum wires and copper strips is achieved, the contact area between the aluminum wires and the copper strips is increased, a tight wrapping structure is formed for subsequent connection between the copper strips and the aluminum wires, and the conductivity of the copper-clad aluminum photovoltaic welding strip is remarkably improved; and before wrapping, scraping of an oxide layer and impurities on the surface of the aluminum wire, scrap cleaning and straightening treatment of the aluminum wire are realized, so that the layering risk of a copper-aluminum interface is avoided, the conductive efficiency is further improved, and the transmission loss of energy is reduced.

The application discloses a process method for improving Pd distribution on a FAB surface of a palladium-plated copper wire, and belongs to the technical field of semiconductor bonding wire materials. The application uses a dichlorotetraammine palladium plating system as a basis, uses Ni elements and / or platinum group noble metal elements as plating liquor modification components, combines copper core pretreatment, pulse plating, gradient coating preparation, IMC interface presetting and post-treatment, uses the interface diffusion barrier characteristics of Ni, uses the high surface energy advantage of platinum group noble metals, improves Pd-Cu interface diffusion activation energy, and solves the problems that in the existing palladium-plated copper wire FAB ball forming process, a Pd layer is easy to excessively diffuse to a copper core, surface Pd coating is discontinuous, and it is difficult to form a dense solid protective layer. The application widens the selection window of modification elements, takes into account low cost and high reliability, is suitable for existing dichlorotetraammine palladium industrial plating production lines and mainstream bonding equipment, does not need equipment modification, is stable and controllable, and is suitable for large-scale mass production application of semiconductor packaging palladium-plated copper wires.

An anti-backflow commutator includes a bakelite powder substrate with a mounting hole at its center. Commutator segments are evenly distributed around the outer circumference of the substrate. Mica sheets are used for inter-segment insulation between adjacent commutator segments. Each commutator segment includes a commutator body with dovetail grooves around its bottom. The bottom surface of each dovetail groove is an upward-sloping surface, so that the bottom of the commutator body is dovetail-shaped in both the transverse and longitudinal sections. A copper foot is located at the bottom of the commutator body, with symmetrical mounting grooves on both sides. This invention achieves multi-directional anti-backflow and anti-torsion locking between the commutator segments and the substrate through a multi-dimensional dovetail groove structure. Combined with the multiple anchoring structure of the copper foot, it significantly improves the anti-backflow and anti-torsion capabilities of the commutator segments. The structure is reliable and suitable for high-speed, high-power motor applications.

The application relates to the technical field of cable processing, in particular to a non-woven shielding type fireproof data cable processing method, which comprises the following steps: obtaining tension data of each copper wire in a fireproof data cable processing process and rotating speed data in a winding process, analyzing a non-linear change coefficient of the tension data of the copper wire in each time period, combining a fluctuation degree of a frequency amplitude of the tension data of the copper wire in each time period in a frequency domain, obtaining abnormal values of non-linear change and random violent shaking of the tension data of the copper wire in each time period, analyzing a correlation between the rotating speed data in each time period and the tension data of each copper wire, obtaining an influence coefficient of a copper wire tension difference and rotating speed change during shielding layer processing, combining a gap change degree between the copper wires to obtain a gap abnormality coefficient, adjusting a gain coefficient of copper wire tension adjustment in the fireproof data cable processing process, and completing the processing of the fireproof data cable. The application can improve the processing quality of the fireproof data cable.

The application provides an automatic loading method, device and equipment based on a grabbing machine and a storage medium, and the method comprises the following steps: if a vehicle to be loaded is parked in a preset parking area, the current delivery plan of a copper rod coil is obtained, the delivery plan at least comprising the delivery quantity and the standard size of the copper rod coil; the loading positions of the copper rod coils in the delivery quantity are planned in combination with the standard size of the copper rod coil and the car compartment size of the vehicle to be loaded, so as to determine the loading positions of the copper rod coils; the copper rod coils in the finished product warehouse are screened multiple times according to a preset screening rule, so as to determine the target copper rod coils in the delivery quantity, and the preset screening rule at least comprising the shortest distance between the copper rod coil and the vehicle to be loaded or / and the longest storage time of the copper rod coil in the finished product warehouse; and the grabbing machine is controlled according to the loading positions to automatically load the target copper rod coils. In this way, the automatic loading process is realized based on the grabbing machine, the loading efficiency and quality are improved, and the labor cost is reduced.

The invention relates to the technical field of hydro-generator cooling, in particular to a hydro-generator stator cooler tube expansion process and a copper tube wall thickness calculation method, comprising the following steps: S1, collecting cooling water quality parameters of a hydro-generator stator cooler to generate a water quality parameter data set; s2, inputting the water quality parameter data set into a physical-empirical mixed corrosion model according to the material characteristics of the copper pipe, calculating the expected corrosion rate and corrosion allowance of each pipe section, and outputting pipe section corrosion data; and S3, the pipe section corrosion data is combined with the copper pipe strength and design service life requirements, the self-adaptive wall thickness of each pipe section is calculated, and wall thickness design data is formed. According to the method, self-adaptive wall thickness design data is formed by combining the strength characteristic of the copper pipe, and differentiated wall thickness configuration is achieved; the defects caused by an empirical method of uniformly adding the allowance are avoided, the local corrosion resistance is improved, and unnecessary material redundancy is reduced, so that the risks of perforation and leakage of the cooling pipe are reduced.

The application discloses a kind of based on copper plate strip surface quality roll grinding management method, to solve the existing roll grinding depends on experience, positioning is not accurate, overgrinding or insufficient problem.This method includes: collecting copper plate strip surface copper printing defect and flatness waveform data, and with the rolling speed and roll length count signal of rolling mill time stamp synchronization calibration;Build roll damage reverse diagnosis mechanism, combined with copper printing coordinate calculation damage angle, identify damage type, calculate wear depth;For different damage types generate differentiated grinding work order, execute high-precision positioning grinding;Return to production line after original damage position carries out online real-time monitoring and off-line sample review, dynamically adjust parameter and determine grinding qualified state.The application realizes the precision, differentiation and closed-loop management of roll grinding, effectively improves grinding efficiency and roll service life, significantly improves copper plate strip surface quality, reduces defect rate.

The present disclosure provides a screening method, a processing method, a wafer, a screening device, an apparatus and a medium. The screening method comprises: obtaining wafer trace information of a wafer to be screened; determining whether the wafer to be screened has intrinsic gettering capability based on the wafer trace information and a preset gettering capability judgment standard, wherein the intrinsic gettering capability refers to the ability of the wafer to be screened to bind copper impurities by using the intrinsic defect structure naturally formed in the growth process of the wafer; if the determination is yes, the wafer to be screened is marked as a wafer with intrinsic gettering capability; if the determination is no, the wafer to be screened is marked as other wafers. The screening method screens the wafer with intrinsic gettering capability according to the wafer trace information, avoids the complex steps of actively introducing gettering traps in the traditional process, simplifies the screening process, improves the efficiency, and helps to ensure the surface cleanliness of the wafer in the subsequent manufacturing.

A novel copper-steel composite pressure ring for a submerged arc furnace comprises a plurality of pressure ring units, the pressure ring units are sequentially connected end to end to form an annular structure, each pressure ring unit comprises a pressure ring unit body, a cooling water channel is arranged in each pressure ring unit body, and a water inlet and a water outlet are formed in the two ends of each cooling water channel respectively. The pressure ring unit is characterized in that the pressure ring unit body comprises an outer copper plate and a copper bottom boss, the copper bottom boss is arranged on the inner side of the lower end of the outer copper plate, and the outer copper plate and the copper bottom boss are made of copper into a whole; an inner side steel plate is compounded on the inner side surface of the outer side copper plate and is tightly combined with the outer side copper plate; and a bottom steel plate is compounded on the upper surface of the copper bottom boss and is tightly combined with the copper bottom boss. The novel copper-steel composite pressure ring for the submerged arc furnace not only has strong cooling performance, but also has higher overall mechanical strength and strong deformation resistance, and is beneficial to prolonging the service life.

The invention is applicable to the technical field of copper foil surface roughening for flexible copper-clad plates, and particularly relates to a copper foil surface laser roughening method for a flexible copper-clad plate, a copper foil and a flexible copper-clad plate, and the method comprises the following steps: collecting local tensile deformation, initial length and sectional area of the copper foil and environment temperature of a copper foil processing area in a laser roughening process; determining the local tensile deformation rate of the copper foil according to the tensile deformation amount and the initial length, and judging whether the local stress of the copper foil is uniform or not; if the stress is not uniform, the calibrated copper foil elasticity modulus is obtained according to the environment temperature of the copper foil processing area, and the local tension of the copper foil is determined by combining the local tensile deformation rate and the sectional area of the copper foil; determining a laser scanning speed matched with the local tension of the copper foil based on the local tension of the copper foil and a correlation model of the local tension of the copper foil and the laser scanning speed; and controlling the laser head to perform laser roughening treatment on the surface of the copper foil according to the laser scanning speed. According to the embodiment of the invention, the uniformity of the surface roughness of the copper foil can be improved.

The application relates to a low-temperature-resistant construction high-voltage flexible cable, which is characterized by comprising a plurality of heat preservation pipes, an insulated wire core composed of a plurality of insulated conductors, a filling body, an isolation sleeve, a steel wire armor layer, a winding and binding copper belt and an outer sheath; the cable is suitable for construction insulation and sheath cracking prevention under a low-temperature environment below -15 DEG C, can effectively make the cable laying construction no longer be restricted by the low-temperature environment of a construction region, has high construction efficiency and low cost, and has popularization and application value. In addition, in specific application, water vapor is introduced into the heat preservation pipe during laying construction, and the condensed water is left in the heat preservation pipe; when the cable is high-load heated, the condensed water left in the heat preservation pipe can absorb part of the heat, the heat load of the cable conductor is higher, the carrying capacity is larger, the aging degree of the insulation and sheath material in the cable due to high temperature is reduced, and the service life of the cable can be prolonged to a certain extent.

The invention discloses a rhenium-copper double-loaded ozone catalyst and a preparation method and application thereof. The preparation method comprises the following steps: uniformly mixing aluminum oxide with copper salt, rhenate and a solvent, and standing overnight after vibration treatment; and filtering, collecting filter residues, and roasting to obtain the rhenium-copper double-loaded ozone catalyst. According to the rhenium-copper double-loaded ozone catalyst, activated aluminum oxide serves as a carrier, perrhenate radicals and copper ions serve as main active components, copper can inhibit metal ions from being dissolved out, and the rhenium-copper double-loaded ozone catalyst is prepared through an impregnation and calcination method; copper and rhenium are effectively loaded on porous activated aluminum oxide through high-temperature roasting, and ozone is adsorbed and promoted to be decomposed into hydroxyl free radicals, superoxide free radicals, singlet oxygen and other active oxygen in combination with the reaction activity of copper ions and perrhenate radicals, so that the purposes of effectively degrading organic matters in water and purifying water are achieved.

The invention discloses an agitation leaching method for iron-manganese coated copper oxide ore, and relates to the field of hydrometallurgy. According to the method, in the leaching process of complex copper oxide ore containing iron, manganese and combined copper, a composite catalytic oxidizing agent with super-strong oxidizing capacity is added and is matched with an acid leaching agent sulfuric acid and the like to leach the copper ore, and due to the enhanced oxidation effect of the catalytic oxidizing agent, the oxidation reaction of minerals which can only occur at high temperature and high pressure is triggered at normal temperature and normal pressure; meanwhile, operation can be carried out at normal temperature and normal pressure, and the process limitation and the defect that the prior art depends on high temperature and high pressure are avoided, so that the effects of effectively reducing energy consumption, reducing equipment corrosion and improving the working environment are achieved, the technological process is simplified, the requirement for equipment is lowered, and the method is suitable for industrial production. Therefore, the leaching rate is improved, and better economic benefits are obtained.

The invention discloses a leaching method for enhanced catalysis of bound copper ore, and relates to the technical field of copper ore leaching, the method comprises the following steps: carrying out wet ball milling on bound copper ore to 200 meshes, and adjusting the ore pulp concentration to 40%; under the stirring state, 10m < 3 > / h oxygen-enriched air is introduced through a Roots blower, a biomass particle steam generator is adopted for heating to 70 DEG C, and citric acid with the mass being 3% of the mass of the ore is added for enhanced catalytic pretreatment for 1.5 hours; then adding a sulfuric acid leaching agent with the concentration of 10%, and leaching for 3.5 hours, wherein the total process time is 5 hours; and after filter pressing separation, leaching liquid is replaced with iron powder with the purity being larger than or equal to 98% to generate spongy copper with the grade being larger than or equal to 85%, and after tailings are discharged in a dry mode, lime is added to adjust the pH to 7 for brick making. According to the method, through the synergistic effect of fine grinding, organic acid catalysis and oxygen-enriched heating, efficient dissolution of iron and manganese inclusion and copper mineral monomer dissociation are achieved, the copper leaching recovery rate is increased to 95% or above, the process is mild, reagents are cheap, operation is easy, tailings can be recycled, economical efficiency and environment friendliness are both considered, and the method is suitable for large-scale industrial application.

The invention relates to the technical field of cooling towers, in particular to welding equipment for filter machining. Comprising a welding table, a base plate and a movable frame, a wire feeding device is arranged at the bottom of the movable frame, wire pressing plates are elastically arranged on the two sides of the movable frame, electrode plates are arranged on the inner sides of the wire pressing plates, a bottom plate is fixedly arranged at the bottom of the wire feeding device, and a wire separating mechanism is arranged at the bottom of the bottom plate in a sliding mode. The wire separating mechanism is arranged on the base and transversely moves in the copper wire in a penetrating mode, so that a notch for containing soldering tin is formed in the copper wire, a wire expanding mechanism is arranged in the wire separating mechanism, and the wire expanding mechanism comprises a power part arranged on the wire separating mechanism in a sliding mode. The pressing plate is used for pressing the wire expanding block, the wire expanding block is forced to abut out the copper wire at the slope face towards the two sides through clockwise rotation, an outer concave area is formed in the copper wire to contain more soldering tin, and therefore the contact area of the soldering tin and the copper wire is increased, and the welding firmness is improved.

This invention discloses a silver-free double-sided conductive AMB copper-clad ceramic substrate and its preparation method, belonging to the field of electronic packaging technology. The substrate has a composite structure of "copper circuit layer - silver-free active metal modification layer - ceramic substrate - silver-free active metal modification layer - copper circuit layer". The double-sided conductive component penetrates the ceramic substrate and forms a stable conductive connection with the upper and lower copper circuit layers. The silver-free active metal modification layer contains no elemental silver or silver-based alloys, achieving silver-free metallurgical bonding. The copper circuit layer is prepared using dry pattern transfer technology. The substrate is prepared through the following steps: ceramic substrate pretreatment and microvia processing, conductive pillar preparation, silver-free active layer preparation, composite structure assembly, pulse brazing, and post-processing. This invention avoids the use of precious metal silver, reducing costs while ensuring thermal conductivity, electrical conductivity, and high-precision patterning. It is suitable for high-end applications with stringent requirements for substrate heat dissipation and reliability, such as power modules for new energy vehicles, 5G base stations, and photovoltaic inverters.

The invention relates to the technical field of lithium batteries, in particular to a negative current collector, a negative pole piece, a secondary battery and an electrochemical device, an alloy transition layer is arranged on the surface of a copper layer, so that the problem of low binding energy caused by large lattice size difference between interfaces of the copper layer and a nickel layer can be avoided; the copper-nickel alloy transition layer can well combine the copper layer and the nickel layer at the same time. And the nickel layer is arranged on one side, deviating from the copper layer, of the alloy transition layer, so that the corrosion resistance of the negative electrode current collector can be improved. By controlling the particle size Dv50 of the copper crystal particles and the nickel crystal particles and controlling the volume percentage of the copper crystal particles with the grain size smaller than 100 nm to the copper crystal particles with the grain size smaller than 100 nm in the range, the K value of the battery can be remarkably reduced, the corrosion resistance of the negative electrode current collector is improved, and the anti-fatigue life of the negative electrode current collector is prolonged; the problem that the negative current collector is easy to break after multiple cycles of the battery is improved.

The invention discloses a high-thermal-conductivity diamond / copper-yttrium composite material and a preparation method thereof, and the preparation method comprises the following steps: mixing tungsten-plated diamond particles with copper-yttrium alloy powder, and then carrying out spark plasma sintering to obtain the composite material. According to the composite material, a copper yttrium compound / WC double-interface structure is formed, combination of diamond and a copper matrix is strengthened through a WC layer, and the interface combination condition of WC and the copper matrix is improved through a copper yttrium compound. By means of diamond surface tungsten plating modification and copper-yttrium matrix alloying, good bonding of a diamond / copper composite material interface is achieved, and the heat conductivity of the composite material can reach 600 W / (m * K) or above.

The invention discloses a method for preparing silver-coated copper glue by using silver methanesulfonate as a silver source. The method comprises the following steps: firstly, carrying out hydrothermal pretreatment on copper powder to remove surface oxides and improve the crystallinity; meanwhile, preparing a silver methanesulfonate solution as a main salt for chemical plating; then, a chemical plating method is adopted, the surface of the pretreated copper powder is coated with a uniform silver layer, and high-quality silver-coated copper powder is obtained; and finally, mixing the prepared silver-coated copper powder serving as a conductive filler with epoxy resin and a curing agent according to a preset proportion to obtain the silver-coated copper conductive adhesive. The silver methanesulfonate is used for replacing traditional silver nitrate, oxidation corrosion of nitrate to a copper matrix is effectively avoided, the oxidation resistance of the filler and the coating quality are remarkably improved by combining the hydrothermal treatment of the copper powder, and the finally prepared conductive adhesive has excellent conductivity and long-term stability and is suitable for the fields of electronic packaging and the like.

The invention discloses a feeding device for flame retardant processing, and relates to the technical field of flame retardant processing and feeding, the feeding device comprises a base, and the top of the base is provided with a cooling and feeding mechanism. When the feeding device is used, the air cooler conveys cold air into the three-way pipe, two air flows are formed and enter the center cavity and the air cavity correspondingly, the cold air in the air cavity enters the hollow cavity through the second communication hole and the first communication hole, heat exchange is achieved between the cold air and cold air absorbed by the copper-based foam metal framework, and the temperature of the feeding blades and the temperature of raw materials are reduced. And meanwhile, cold air in the center cavity penetrates through the aluminum-based silicon carbide composite layer to take away heat of the rotating shaft, and raw material temperature reduction is assisted. The cooling feeding mechanism is combined with a copper-based foam metal framework, so that cold air heat exchange can be enhanced, the overall strength can be enhanced, and cooling and strength are improved; and the aluminum-based silicon carbide composite layer is combined to bear torque transmission by virtue of high torsional strength and assist in cooling at the same time.

The invention discloses a leadless double-sided heat dissipation power module and a packaging integration method thereof. Firstly, high-strength and low-thermal-resistance interconnection of a chip and a substrate is realized by adopting a low-temperature sintering technology; electrical interconnection between the chips is completed by using a precise bridging technology; and finally, a high-integration-level FPC is introduced as a signal control end, so that thorough leadless packaging is realized. The lead-free structural advantage further brings multiple benefits: the height of a metal cushion block (such as a copper cushion block) used for electrical connection and heat dissipation is allowed to be remarkably reduced, so that the size of the module is greatly reduced in a three-dimensional space, and the power density is improved in a breakthrough manner. And meanwhile, the thinner copper metal cushion block effectively shortens the heat dissipation path at the top of the module, and an efficient double-sided heat dissipation channel is jointly formed by combining the excellent heat conductivity of copper, so that the overall heat resistance of the module is remarkably reduced, and the heat dissipation efficiency and the power circulation capability are improved.