The invention discloses an environment-friendly carborundum wire cutting fluid. Raw materials of the wire cutting fluid comprise the following components by the weight percentage: 3-5% of a multi-branched chain alcohol modified surfactant, 3-5% of dodecynediol polyoxyethylene ether, 0.5-1% of a hyperbranched Gemini cationic surfactant, 5-15% of a special type of alcohol ether, 3-5% of isostearic acid, 3-5% of AMP-95 and the balance being deionized water added to make the total amount of 100%. The wire cutting fluid has excellent wetting, cooling, lubricating, cleaning, low-foaming and settlingproperties, and has good wetting and permeating properties; the cutting fluid has good antibacterial property, so deterioration of the cutting fluid is prevented, the cutting fluid can be recycled, the cyclic utilization rate is high, and the service life of the cutting fluid is effectively prolonged. The cutting fluid can effectively prevent TTV large and line marks on the surface of a silicon wafer and brittle cracking or scratching of the silicon wafer in the cutting process, improve the smoothness of the surface of the silicon wafer, avoid warping of the silicon wafer, enable the thickness of the processed silicon wafer to be uniform and consistent, and improve the yield.