The invention provides a method for preparing a metal oxide thin-film resistive random access memory through plasma processing, wherein the method belongs to the technical field of electronic films and components. The memory comprises the components of a substrate, a lower electrode, a fluorine-doped metal oxide and an upper electrode. According to the method, a relatively novel plasma processing method is utilized for conveniently and controllably preparing a metal oxide resistive random access functional layer with uniform defect distribution. The metal oxide resistive random access functional layer can conveniently and quickly realize switching between formation and switching-off of a conductive channel under the function of an electric field, namely switching between a low-resistance state and a high-resistance state of the device. Furthermore, the method has an ultralow working voltage. The upper electrode is prepared through a mask method, thereby greatly reducing device dimension and improving integration density. Through testing, the metal oxide thin-film resistive random access memory prepared according to the method has excellent performance. In one word, the invention realizes the method for preparing the metal oxide thin-film resistive random access memory with advantages high performance and small dimension, wherein the method has advantages of simple operation, effective controllability, high efficiency and low cost. Furthermore relatively high performance consistency is realized. The method is suitable for batch resistive random access array production in future, and furthermore has good application prospect.