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58results about How to "Improve high temperature characteristics" patented technology

Long-life aluminum electrolytic capacitor and manufacturing method thereof

The invention belongs to the technical field of electrolytic capacitors, and in particular discloses a long-life aluminum electrolytic capacitor and a manufacturing method thereof. The aluminum electrolytic capacitor comprises an aluminum shell, a positive guide pin, an anode foil, a negative guide pin, a cathode foil and an electrolytic paper, wherein the electrolytic paper is arranged between the anode foil and the cathode foil, and with the electrolytic paper, the anode foil and the cathode foil are wound together to form a core bag; a cover body is sleeved on the core bag and the core bagis arranged in an aluminum shell; the nail connecting part of the negative guide pin and the cathode foil is provided with a foliation; the foliation covers a nail connecting hole of the cathode foiland the negative guide pin; the anode foil has high withstand voltage and low specific volume; the cathode foil is a formation cathode foil; and the electrolytic paper has low tightness and high thickness. The aluminum electrolytic capacitor has high temperature resistances and high-ripple current impact resistance, the high-temperature load service life reaches 20000 hours or longer at 105 DEG Cfor, and problems of short service life, low stability and poor capability of stable ripple current resistance of the aluminum electrolytic capacitor in the prior art are solved effectively.
Owner:江华绿宝石新能源储能科技有限公司

Preparation method of high-nickel positive electrode material

The invention discloses a preparation method of a high-nickel positive electrode material, which comprises the following steps: uniformly mixing up a Ni-containing hydroxide, a lithium-containing compound and a doping element, and calcining to obtain a base material A after the mixing operation; adding the base material A into a washing solution, controlling the temperature of the washing solution, washing away residual lithium carbonate and lithium hydroxide on the surface, adding a lithium-containing compound into the washing solution, and drying the washed base material to obtain a mixtureB; uniformly mixing the mixture B, a coating element and a lithium-containing compound, calcining, and crushing to obtain the finally modified high-nickel positive electrode material. The high-temperature stability of the nickel material is improved through doping. The residual lithium carbonate and lithium hydroxide on the surface are reduced through washing. The water absorption and processing performance of the material is improved. The damage to the surface of the material during washing can be repaired through coating. The direct contact between the positive electrode material and the electrolyte can be reduced, so that the high-temperature characteristic and long-cycle performance of the battery cell are improved.
Owner:浙江迈纳新材料有限公司

6H-SiC substrate reversed polarity AlGaInP LED chip

The invention discloses a 6H-SiC substrate reversed polarity AlGaInP LED chip and a manufacturing process thereof. The reversed polarity AlGaInP LED chip comprises a substrate and an epitaxial layer on the substrate, wherein a 6H-SiC material is used as the substrate; and the epitaxial layer sequentially comprises an N-type AlGaInP layer, a light emitting layer, a P-type AlGaInP layer, a P-type GaP layer and a metal reflecting and bonding layer from top to bottom; the N-type AlGaInP layer is provided with an N-type electrode; and the bottom surface of the 6H-SiC substrate or the metal reflecting and bonding layer is provided with a P-type electrode. The manufacturing process comprises the steps that the surface of the 6H-SiC substrate is provided with the metal reflecting and bonding layer in a vapor deposition mode; the epitaxial layer and the substrate are bonded together; then a selective corrosion method is used for corroding and peeling off an original CaAs underlay; and the electrode formed by the processes of vapor deposition, corrosion, and the like is manufactured into a pipe core. The 6H-SiC substrate reversed polarity AlGaInP LED chip uses the 6H-SiC substrate material with high heat conductivity as the substrate and transfers an LED light emitting layer onto the 6H-SiC substrate so as to improve the high-temperature characteristics of products and improve the reliability of the products.
Owner:Shandong Huaguang Optoelectronics Co. Ltd.

Trench isolation lateral insulated gate bipolar transistor

The invention provides a semiconductor device capable of improving the voltage endurance capability and the high temperature endurance of a common insulated gate bipolar transistor and avoiding the current rebounding phenomenon. According to the semiconductor device, a P type substrate is provided with a buried oxide layer, the buried oxide layer is provided with a drift region, a P type body region is arranged on one side of the drift region, and an N type buffer layer is arranged on the other side of the drift region. A P type emitter region and an N type emitter region connected with the P type emitter region are arranged in the P type body region, and the P type body region is provided with metal used for being connected with the P type emitter region and the N type emitter region and an emitter metal field plate. A P type collector region is arranged in the N type buffer layer, and the N type buffer layer is provided with metal used for connection and a collector metal field plate. A polysilicon gate is arranged above the portion, between the buried oxide layer and the N type emitter region, of the P type body region. Two trench isolation layers are arranged outside an N type body region, a gap for a carrier to flow is reserved between the two trench isolation layers, and two N type collector regions are arranged outside the trench isolation layers and connected with the P type collector region through the metal.
Owner:SOUTHEAST UNIV

IGBT capable of realizing localized service lifetime controlling and manufacturing method thereof

The invention brings forward an insulated gate bipolar transistor (IGBT) capable of realizing localized service lifetime controlling and a manufacturing method thereof. The IGBT comprises a current collection region; a buffer layer is formed on the current collection zone; and a drift region is formed on the buffer layer. At least one low-service life high recombination layer is formed between the current collection region and the drift region; and a recombination center is arranged in the low-service life high recombination layer, so that the service life of the carrier is reduced. Besides, well regions are formed in the drift region; emitter regions are formed in the well regions; a gate dielectric layer, a grid electrode and an emitter are successively formed on the drift region; and a collector is formed under the current collection region. According to the invention, because at least one low-service life high recombination layer is formed between the current collection region and the drift region, the low-service life high recombination layer can recombine lots of excess carriers that are generated in a device turn-on state, thereby improving recombination currents and reducing hole injection of the current collection region. Therefore, the turn-off trailing time is shortened; objectives of on-off time reduction and on-off loss reduction can be achieved; and the anti-latch capability of the device is improved.
Owner:BYD SEMICON CO LTD

Neodymium-iron-boron permanent magnet and preparation method and application thereof

The invention discloses a neodymium iron boron permanent magnet and a preparation method and application thereof. The grain boundary phase and the main phase of the neodymium iron boron permanent magnet have the following structure distribution: the total length of the grain boundary phase in the measurement range is recorded as Lm, the total length of the grain boundary phase with the grain boundary width of more than or equal to 1 [mu] m in the measurement range is recorded as Ln, and Lm and Ln satisfy the relationship of 0.40 < = Ln/Lm < = 1; in the measurement range, the total length of grain boundary phases with the width between adjacent grain boundaries being larger than or equal to 2 microns is recorded as Lx and Lm, and Lx meets the relation that Lx/Lm is larger than or equal to 0and smaller than or equal to 0.2; the total length of the grain boundary phase scanned by the EPMA line in the measurement range is recorded as Le, the total length of the grain boundary phase scanned by the EPMA line in the measurement range is recorded as LM, and Le and LM meet the relationship of 0.40 < = Le/LM < 1. The high-temperature demagnetization-resistant magnet with high Br, high Hcj,high square degree, specific grain boundary phase and main phase structure is prepared.
Owner:YANTAI ZHENGHAI MAGNETIC MATERIAL CO LTD

High-temperature working DFB laser and epitaxial structure growth method

The invention discloses a DFB laser for improving the high-temperature characteristics of a laser, and the epitaxial structure of the DFB laser comprises an InP substrate which is sequentially provided with a buffer layer, a grating layer, a lower limiting layer, a lower waveguide layer, a quantum well, an upper waveguide layer, an electron blocking layer, a corrosion blocking layer, a ridge waveguide layer, a potential barrier gradient layer and an ohmic contact layer from the bottom to the top; the electron blocking layer is a superlattice formed by AlAs0.56Sb0.44 with ternary components andAlxGa(1-x)AsySb(1-y) materials with quaternary components. According to the epitaxial structure of the DFB laser, a wide-bandgap superlattice electron blocking layer is designed through energy band engineering to limit carriers, on one hand, the probability that the carriers overflow out of a quantum well active region at high temperature is reduced through a high potential barrier, on the otherhand, the valence band potential barrier is reduced through superlattices, hole injection into the active region is facilitated, the high-temperature characteristic of the laser can be effectively improved, and the DFB laser can work normally within the temperature range of -40 DEG C to 115 DEG C.
Owner:全磊光电股份有限公司

Super junction device and manufacturing method thereof

PendingCN112786677ASame ratio on-resistanceSame specific on-resistance (Rsp)Semiconductor/solid-state device manufacturingSemiconductor devicesReverse recoveryEngineering
The invention discloses a super junction structure, and the structure is formed above the surface of a first N-type epitaxial layer, wherein the width of a P-type column at the top position of a super junction unit is less than that of an N-type column and is unchanged in a step mode; the N-type column is composed of a second N-type epitaxial layer filling grooves, the P-type column is composed of a first P-type epitaxial layer between the grooves, and the first P-type epitaxial layer is formed on the first N-type epitaxial layer; the grooves penetrate through the first P-type epitaxial layer, and the bottoms of the grooves are in contact with the first N-type epitaxial layer; the total amount of P-type impurities of the P-type column in the super junction unit is matched with the total amount of N-type impurities of the N-type column, the second N-type epitaxial layer is formed by overlapping at least two N-type epitaxial sub-layers, and the doping concentration of the first N-type epitaxial sub-layer is higher than that of the P-type column. The invention further discloses a manufacturing method of the super junction device. According to the invention, the process control difficulty can be reduced, the charge balance of the super junction unit can be improved, the reverse recovery current of the body diode is reduced, and the high-temperature characteristic of the device is improved.
Owner:NANTONG SANRISE INTEGRATED CIRCUIT CO LTD

AlGaN-based double-channel Schottky diode based on groove anode structure and preparation method

The invention relates to an AlGaN-based double-channel Schottky diode based on a groove anode structure and a preparation method. The diode comprises a substrate, a buffer layer, a channel layer, a first barrier layer, a superlattice layer, a second barrier layer and a GaN cap layer, an anode and a cathode; the substrate, the buffer layer, the channel layer, the first barrier layer, the superlattice layer, the second barrier layer and the GaN cap layer are sequentially stacked from bottom to top; a first conductive channel is formed between the channel layer and the first barrier layer; a second conductive channel is formed between the superlattice layer and the second barrier layer; the anode is arranged on the GaN cap layer; the bottom of the anode sequentially penetrates through the GaN cap layer and the second barrier layer; the anode is located in the superlattice layer; the anode and the superlattice layer form Schottky contact; the cathode is arranged on the GaN cap layer and surrounds the periphery of the anode; a distance exists between the cathode and the anode; and the cathode and the GaN cap layer form ohmic contact. According to the AlGaN-based double-channel Schottky diode based on the groove anode structure, the conductive channels are adopted, so that the electron concentration is improved, and the on-resistance is reduced.
Owner:XIDIAN UNIV

Preparation method of green electromagnetic shielding building material

The invention provides a preparation method of a green electromagnetic shielding building material, which comprises the following operation steps: selecting a proper amount of carbon nanotubes, and cutting the carbon nanotubes by a chemical longitudinal cutting method. Nano Fe3O4 particles and graphene oxide nanobelts are compounded to prepare a ferroferric oxide-graphene oxide nanobelt compositematerial, the ferroferric oxide-graphene oxide nanobelt composite material is reduced to obtain a Fe3O4-graphene nanobelt composite material; and the ferroferric oxide-graphene nanobelt composite material with different Fe3O4 loading capacities is prepared by adjusting the Fe3O4 loading capacity. The wave-absorbing performance of the material with the continuous thickness of 0.5 mm and 5 mm is calculated, the wave-absorbing performance of the material with the ratio of F to G being 1: 1 and the wave-absorbing performance of the material with the ratio of 2: 1 are the best, and the optimal loading capacity and the optimal thickness of Fe3O4 can be determined. The green electromagnetic shielding building material has the characteristics of light weight and wide wave absorption, and is convenient for industrial large-scale production. The material can be used in a multimedia indoor venue with a large number of electronic devices, not only can protect the health of visitors, but also can improve the visiting experience.
Owner:TSINGHUA UNIV
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