The invention discloses a
chip packaging structure and a preparation method thereof. The preparation method comprises the following steps: providing a support plate, and preparing double-layer peeling structures on the upper surface and the lower surface of the support plate; preparing a rewiring layer on the side, away from the support plate, of each double-layer peeling structure; preparing first
dielectric layers on each rewiring layer and the surface of each double-layer peeling structure; preparing at least one
blind hole in each first
dielectric layer; filling a conducting material in the blind holes; providing a
chip, and arranging the
chip on each first
dielectric layer; preparing a second
dielectric layer on the periphery of each chip, wherein each first
dielectric layer is covered with the corresponding second
dielectric layer, and each chip is wrapped by the corresponding second dielectric layer; peeling off the double-layer peeling structures;
etching an upper-layer structure of each double-layer peeling structure so as to
expose the corresponding rewiring layer and the corresponding first dielectric layer; and preparing a welded ball on the side, away from each first dielectric layer, of the corresponding rewiring layer, wherein each welded ball is electrically connected with the corresponding rewiring layer. To sum up, the preparation method is simple, high in
operability and low in cost, and can avoid chip damage; and moreover, preparation technology is carried out on two sides of the support plate simultaneously, so that the efficiency is high, and warping is avoided.