The invention provides a through hole conductive film, a preparation method thereof and application. The preparation method of the through hole conductive film comprises the following steps: a, taking a single-layer or multi-layer film of which the thickness is between 3 and 1,000 microns to perform plasma, ion beam or corona treatment so that the surface dyne value is between 39 and 75; b, perforating the film after the treatment; c, performing ion plating, magnetron sputtering plating, vapor deposition and chemical sensitization on the hole wall and at least one surface of the perforated film until a conductive layer of which the thickness is between 0.005 and 0.5 microns is generated; and d, electroplating or chemically plating metal outside the conductive layer until the thickness of the plating layer is between 0.01 and 5 microns, the resistance value is between 0.003 and 10 omega/sq, and the pore diameter of a product is between 1 and 5,000 microns. The surface resistance and the vertical resistance of the through hole conductive film are between 0.005 and 10 omegas, the adhesive force is good, and the screening effectiveness is more than 70 dB; besides, the through hole conductive film is applied to the field of software electromagnetic screen and omnibearing conductive adhesives, and can obtain various functional materials which are heat resistant, inflaming retarding and the like.