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6 results about "Chlorine trifluoride" patented technology

Chlorine trifluoride is an interhalogen compound with the formula ClF₃. This colorless, poisonous, corrosive, and extremely reactive gas condenses to a pale-greenish yellow liquid, the form in which it is most often sold (pressurized at room temperature). The compound is primarily of interest as a component in rocket fuels, in plasmaless cleaning and etching operations in the semiconductor industry, in nuclear reactor fuel processing, and other industrial operations.

Hybrid coatings for chamber components

PCT designated stageWO2026072082A1Vacuum evaporation coatingSputtering coatingHexafluoroethaneAluminium chloride
An apparatus includes a body configured to support a substrate, a first coating, conformal on a surface of the body, that is corrosion resistant to at least one of: boron trichloride, nitrogen trifluoride, hafnium tetrachloride, aluminum trichloride, oxygen gas, chlorine gas, fluorine gas, chlorine trifluoride, hydrogen fluoride, hydrogen gas, ammonia, tungsten hexafluoride, tetrafluoromethane, titanium tetrachloride, molybdenum pentachloride, ozone, tetrafluorosilane, or hexafluoroethane, and a second coating, on the first coating, having a hardness that greater than or equal to about 8 gigapascals.
Owner:APPLIED MATERIALS INC

Method for forming semiconductor device structure

A method of forming a semiconductor device structure includes forming a fin structure on a substrate, wherein the fin structure includes a first plurality of semiconductor layers made of a first semiconductor material and a second plurality of semiconductor layers made of a second semiconductor material. A sacrificial gate stack is formed over the fin structure. Portions of the fin structure adjacent the sacrificial gate stack are removed to expose portions of the substrate. A plurality of edge portions of the second plurality of semiconductor layers are removed in a lateral direction to form a plurality of recesses, wherein removing the edge portions includes performing a selective dry etching process using a gas etchant including chlorine trifluoride. An internal spacer is formed in the recess. A source / drain region is formed adjacent the sacrificial gate stack. The sacrificial gate stack and the second plurality of semiconductor layers are removed. A gate structure is formed to replace the sacrificial gate stack and the second plurality of semiconductor layers.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

Synthesis method of dichloromolybdenum dioxide

PendingCN121948546ASulfur and halogen compoundsMolybdenum halidesSulfur tetrafluorideReaction temperature
The invention belongs to the field of synthesis of molybdenum dioxide dichloride, and particularly relates to a synthesis method of molybdenum dioxide dichloride. Comprising the following steps: S1, pretreating a molybdenite raw material; s2, the pretreated molybdenite raw material is placed in a reactor, chlorine trifluoride, oxygen, fluorine mixed gas and inert gas are introduced into the reactor and react with the pretreated molybdenite raw material at the reaction temperature of 20-50 DEG C, and a crude product of dichloromolybdenum dioxide and a crude product of sulfur tetrafluoride are generated; and collecting a dichloromolybdenum dioxide crude product from the bottom of the reactor. The raw ore molybdenite is used as the molybdenum raw material, the cost of the synthesis process is reduced, the process route is simple, and the reaction conditions are milder; in addition, the byproduct sulfur tetrafluoride in the invention is a product with high added value.
Owner:PERIC SPECIAL GASES CO LTD

Device and method for preparing uranium hexafluoride based on uranium-containing molten salt

The invention provides a device and method for preparing uranium hexafluoride based on uranium-containing molten salt, the uranium-containing molten salt contains uranium dioxide and / or triuranium octaoxide, and the device comprises a reaction cavity used for containing the uranium-containing molten salt; the gas inlet is communicated with the reaction cavity and is used for introducing fluorinated gas containing chlorine trifluoride into the reaction cavity, the chlorine trifluoride is subjected to fluorination reaction with each of uranium dioxide and / or triuranium octaoxide, and the fluorination reaction generates reaction gas containing uranium hexafluoride; the gas outlet is communicated with the reaction cavity and is used for discharging reaction gas; and the separation unit is used for separating uranium hexafluoride from the reaction gas.
Owner:SHANGHAI NUCLEAR ENGINEERING RESEARCH & DESIGN INSTITUTE CO LTD

A process for co-producing tungsten halide and carbon tetrafluoride

ActiveCN117285028BTungsten halidesCarbon fluoridesCarbon monofluorideReaction temperature
The present invention relates to a process for the co-production of tungsten halides and carbon tetrafluoride. Tungsten carbide or a mixture of tungsten carbide and carbon is added to a reactor, chlorine trifluoride gas is introduced into the reactor, the reactor temperature is controlled at 340-400°C, the reaction pressure is 0.01-0.15 MPa, and a reaction is carried out to obtain a mixture comprising tungsten hexachloride, tungsten pentachloride, tungsten hexafluoride, and carbon tetrafluoride. After the reaction is completed, the reaction products are sequentially collected through a four-stage cold trap, with the first stage collecting tungsten hexachloride, the second stage collecting tungsten pentachloride, the third stage collecting tungsten hexafluoride, and the fourth stage collecting carbon tetrafluoride. The present invention has relatively mild reaction conditions, a reaction temperature below 400°C, higher safety, low raw material cost, high atom economy, higher safety, lower energy consumption, no by-products, and great economic benefits and development prospects. It meets the production requirements of chemical enterprises for safety, environmental protection, high efficiency, and circular economy.
Owner:PERIC SPECIAL GASES CO LTD

Epitaxial furnace cleaning method and device, electronic equipment and storage medium

The application belongs to the technical field of cleaning silicon carbide epitaxial furnace, and discloses an epitaxial furnace cleaning method, device, electronic equipment and storage medium, the method comprises the following steps: obtaining silicon carbide information of a graphite part in an epitaxial furnace reaction chamber before cleaning; setting the epitaxial furnace reaction chamber as a vacuum cleaning environment; adjusting the motion state of a graphite tray in the epitaxial furnace reaction chamber to a rotating state; using argon and chlorine trifluoride gas, based on a preset temperature range and a preset pressure range, combining the vacuum cleaning environment and the rotating state of the graphite tray, cleaning the epitaxial furnace reaction chamber, obtaining silicon carbide information after cleaning, comparing the silicon carbide information before cleaning with the silicon carbide information after cleaning, and determining the cleaning effect. By setting a vacuum environment, maintaining the rotating state of the graphite tray, and adjusting the corresponding temperature and pressure, argon and chlorine trifluoride gas are used to clean the epitaxial furnace, thereby improving the cleaning efficiency of the epitaxial furnace.
Owner:JIHUA LAB