Structures and methodologies to obtain lasing in indirect gap semiconductors such as Ge and Si are provided and involves excitonic transitions in the 
active layer comprising of at least one indirect gap layer. Excitonic density is increased at a given injection current level by increasing their 
binding energy by the use of 
quantum wells, wires, and dots with and without strain. Excitons are formed by holes and electrons in two different 
layers that are either adjacent or separated by a thin 
barrier layer, where at least one layer confining electrons and holes is comprised of indirect gap 
semiconductor such as Si and Ge, resulting in high optical 
gain and lasing using optical and electrical injection pumping. In other embodiment, structures are described where excitons formed in an 
active layer confining electrons in the direct gap layer and holes in the indirect gap layer; where 
layers are adjacent or separated by a thin 
barrier layer. The carrier injection structures are configured as p-n junctions and 
metal-
oxide-
semiconductor (MOS) field-effect transistors. The 
optical cavity is realized to confine photons. In the case of MOS structures, electrons from the inversion layer, formed under the gate at voltages above threshold, are injected into one or more 
layers comprising of 
quantum wells (2-d), 
quantum wires (1-d) and quantum dots (0-d) structures. The confinement of photons emitted upon 
electron-hole recombination produces lasing in 
active layer comprising of dots / wells. Bipolar 
transistor structures can also be configured as lasers.