This application relates to the field of
wave soldering carrier technology, and provides a
wave soldering carrier and
wave soldering equipment. The wave
soldering carrier includes: a carrier body, the carrier body having an upper carrier surface and a lower carrier surface disposed opposite to each other, the upper carrier surface having a first bearing area and a second bearing area, the first bearing area being used to support the main body section, and the second bearing area being used to support the reinforcing section; the second bearing area having a reinforcing limiting groove, the reinforcing limiting groove being used to limit at least a portion of the reinforcing section having a reinforcing plate, the bottom wall of the reinforcing limiting groove having a first clearance opening communicating with the lower carrier surface, when the flexible circuit board is loaded on the carrier body, the pins of the device to be soldered extend into the first clearance opening through the reinforcing plate and the flexible circuit board, and the bottom end of the pin is flush with the lower carrier surface, or the bottom end of the pin protrudes from the lower carrier surface.