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7results about How to "Break through the size limit" patented technology

Coated particle dispersion fuel pellet and preparation method thereof

The invention belongs to the technical field of nuclear fuel preparation, aims to solve the problems of non-uniform particle distribution and high breakage rate in traditional coated particle fuel preparation, and discloses a coated particle dispersion fuel pellet and a preparation method thereof.The method comprises the steps that firstly, silicon carbide slurry is prepared, a silicon carbide base band is prepared through tape casting equipment, and then the silicon carbide base band is prepared; after tape casting, the base band enters a drying area to be partially dried, TRISO particles are arranged on the surface of the base band at set intervals, the silicon carbide base band is freely curled and formed from one end, degreasing treatment and sintering densification are conducted, and the core block is prepared through the method. Through high-precision tape casting and three-dimensional curling technologies, uniform distribution of TRISO particles in CDF is achieved, and the contact and breakage rate of fuel in the preparation process is reduced.
Owner:CHINA NORTH NUCLEAR FUEL CO LTD

Preparation method of carbon-based semiconductor film material

The embodiment of the invention provides a preparation method of a carbon-based semiconductor thin film material, which comprises the following steps: firstly, bonding a semiconductor subjected to ion implantation and a silicon-based substrate with a dielectric layer to obtain a silicon-based semiconductor material, preparing a through hole for releasing the dielectric layer on the silicon-based substrate, providing a through hole from a supporting substrate for releasing the dielectric layer, and finally preparing a carbon-based semiconductor thin film material. The problem that in the prior art, dielectric layer release needs to provide a channel by patterning a semiconductor film is solved, the size limitation of transfer printing of the semiconductor film is broken through, and then preparation of a large-area semiconductor heterogeneous integrated material is achieved. Besides, the heterogeneous material prepared by the transfer printing Van der Waals integration method almost has no amorphous transition area at the interface, has no limitation on the types of composition materials, and is not influenced by physical factors such as lattice mismatch, thermal mismatch and the like.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Self-adjusting type wind turbine generator set variable pitch bearing cracking monitoring device

The utility model provides a self-adjusting wind turbine generator set pitch bearing crack monitoring device, which comprises an outer bearing, an inner bearing, bearing holes and an external control device, the inner bearing rotates in the outer bearing, the bearing holes are arranged in the inner bearing and the bearing holes in an annular array, and the wind turbine generator set pitch bearing crack monitoring device is used for monitoring the pitch bearing crack of the wind turbine generator set. The position of the detector can be dynamically adjusted according to the diameter and the distance of the bearing hole through sliding fit of the driving plate and the telescopic plate of the adjusting mechanism, when the size of the bearing hole changes, the external control device can drive the driving plate to slide in the first fixing plate, and meanwhile the telescopic plate stretches out and draws back synchronously, so that the detector is accurately aligned with the bearing holes with different hole diameters. Besides, the size of the detection window is matched with the distance between the bearing holes, a second fixing plate can be elastically extruded through a buffer pad in cooperation with an adjusting structure of a threaded rod and a bolt, it is ensured that the upper surfaces and the lower surfaces of the bearings of different sizes are stably clamped, and the problem that a traditional device cannot be matched with the bearing holes of multiple sizes due to a fixing structure is solved.
Owner:BEIJING HUIZHONG DIGITAL ENERGY TECHNOLOGY CO LTD

Hybrid Intermediate Layer and Its Formation Method

PendingCN122094515Aimplement the buildBreak through the size limitSilicon interposerInterconnection density
This application discloses a hybrid interposer and a method for forming the same. The method includes: providing a glass interposer, the glass interposer including a plurality of discrete functional regions and a cut-out region located between adjacent functional regions, the glass interposer including opposing first and second surfaces; forming a first bonding layer on the first surface of the glass interposer; providing a plurality of silicon interposers, each silicon interposer including opposing third and fourth surfaces, the third surface having a second bonding layer; bonding at least one silicon interposer to each functional region of the glass interposer, such that the second bonding layer and the first bonding layer are mixed-bonded; and forming a molding compound covering the silicon interposers on the first surface of the glass interposer, the molding compound exposing the fourth surface of the silicon interposers. This method improves the size and interconnect density of the interposer and reduces the warpage of the interposer.
Owner:JCET GROUP CO LTD