2results about How to "Process defect reduction" patented technology

The invention relates to the technical field of semiconductor devices, in particular to an InGaAs focal plane detector based on DTW integration and a preparation method of the InGaAs focal plane detector, and the InGaAs focal plane detector comprises a silicon-based readout circuit wafer layer, an InGaAs detector array chip layer, N electrode metal and an optical filter film structure layer. The first indium bump array and the second indium bump array are bonded in a flip-chip manner and are filled and fixed by an organic polymer medium; the N electrode metal is respectively connected with the n-InP contact layer and the N electrode region; and the optical filter film structure layer is arranged on the back surface of the InGaAs detector array chip layer. According to the DTW integration technology based on the In salient point array, a traditional N hole structure and a preparation technology are removed, the N electrode is led out from the back face to the N electrode of the reading circuit after the substrate is removed, the technology steps can be simplified, the area of a detector array chip is reduced, a wafer-level machining platform is connected, and the condition for constructing a high-performance optical filtering structure is achieved.

This invention discloses an automated control method and system for the production of spandex spinning oil. The method uses a DCS (Distributed Control System) to detect and self-check the tank level, utilities, and pump / valve status. Upon successful self-check, production access is unlocked; otherwise, it is locked and an alarm is triggered. After unlocking, process parameters from the formula library are retrieved. Material is weighed via a variable frequency pump PID controller linked to a weighing sensor, and the feed flow rate is controlled by fuzzy PID, following the feeding sequence and timer intervals. The DCS issues a grinding command, collecting particle size data in real time; if the particle size does not meet the standard, the grinding time is extended until it does. Heating and stirring are initiated based on the mixing tank level signal, with timed temperature increases to the set value and then maintained. After the two processes are completed, the ground material is fed into the mixing tank for secondary stirring. Successful sampling triggers filling, with fuzzy PID controlling the filling flow rate. Once the liquid level is reached, the valve is closed, and a delayed cleaning process is initiated. After filling is complete, the entire line is shut down. This invention solves the problems of fixed PID control parameters and insufficient interlocking of all processes in traditional PID control methods.