The invention provides a method for producing superfine lead-free solder
powder. The method is implemented in a
reaction system composed of a high-temperature
evaporator, a grain controller, a spraying tank, a collector and the like which are all communicated in sequence.
Tin alloy is placed in the high-temperature
evaporator to be heated and melted, the temperature is maintained for 1 to 3 hours to acquire even
alloy liquid, the power of a
plasma gun is then increased rapidly, the flow of
nitrogen is adjusted,
metal steam is conveyed to the grain controller so as to be gradually cooled, collide with one another and grow, and
alloy drops are generated; the alloy drops enter the spraying tank through air flow and rapidly cooled through
liquid nitrogen to form solder
powder, the solder
powder is conveyed to the collector along with the
nitrogen, attached to the outer wall of a gas-
solid separator in the collector and then collected to a collecting hopper at the bottom of the collector, and therefore the superfine solder powder is acquired, wherein the
nitrogen is cyclically used. The superfine lead-free solder powder produced through the method is hemispherical, the average grain
diameter ranges from 2 micrometers to 7 micrometers, the powder is distributed narrowly, the
oxygen content is low, the purity is high, and alloy components are even.