The invention belongs to the technical field of adhesives, and in particular relates to a low-stress transparent epoxy resin adhesive capable of curing fast at room temperature. The low-stress transparent epoxy resin adhesive is prepared by mixing an epoxy resin component A and a curing agent component B at the volume ratio of 1:1, wherein the epoxy resin component A comprises hydrogenated bisphenol A epoxy resin, bisphenol A glycidyl ether epoxy resin, functional acrylate monomer, an acrylate diluent, a tackifying accelerator and a silane coupling agent; the curing agent component B comprises polymercaptan, a tertiary amine accelerator, a vulcanizing accelerator, a stabilizer, a curing accelerator I and a curing accelerator II. While keeping 5-minute fast curing, high transparency and better bonding strength, the adhesive prepared by the invention has low exothermal temperature and small stress during curing, achieves better applicability in assembly of electronic devices, and has excellent electric insulativity, voltage breakdown resistance, shock resistance and aging resistance, and the application range of mercaptan-epoxy resin type adhesives in manufacturing of electronic devices is greatly expanded.