The invention discloses an anti-
radiation ultrathin p-type
crystalline silicon cell and a preparation method thereof, and belongs to the technical field of photovoltaic device manufacturing. The
cell comprises a
gallium-doped p-type
silicon substrate with the thickness of 60-80 microns, and a functional layer and an
electrode which are sequentially arranged on the front and back surfaces of the
gallium-doped p-type
silicon substrate. The back surface of the
cell is provided with a composite back mirror structure composed of an ultrathin tunneling
oxide layer, a carrier selective transmission layer and a
broadband gap medium
light scattering layer so as to synergistically improve long-wave light absorption and surface
passivation. The front surface of the cell is provided with a stress release groove which penetrates through the
passivation layer and extends into the
silicon body, a selective heavily-doped
contact region is formed in the stress release groove, and the main gate
electrode is filled in the stress release groove to reduce
contact resistance and release mechanical stress. The preparation method adopts a full-low-temperature process, and is realized through key steps of
laser-induced interface texturing,
laser grooving and
gallium doping, co-curing of front and back electrodes and the like. According to the invention, the key problem of serious performance degradation of the ultrathin battery in mechanical
vulnerability, optical loss and
irradiation environments is synchronously solved.