The invention belongs to the technical field of solder, and particularly relates to a lead-free low-temperature solder. The solder comprises, by mass, 0.001-58.0% of bismuth, 0.001-1.0% of silver, 0.001-2.0% antimony, 0.001-0.1% of indium, 0.001-0.15% of phosphorus, 0.001-0.08% of germanium, 0.001-0.015% of beryllium, 0.001-0.015% of cerium and the balance tin. Compared with the prior art, when welding is carried out at the temperature of 139DEG C to 200DEG C, little oxidation slag is generated, the surface of a tin furnace can be kept bright basically without oxidation at the temperature, thesolder can not be oxidized within 50 seconds at 200-260 DEG C, so that the welding efficiency is greatly improved, and the damage to electronic components of a PCBA board is reduced; the low-temperature solder is good in oxidation resistance; and in the welding process, compared with a common Sn-Ag-Cu system, the solder has fewer welding defects, the surfaces of welding spots are very light-bright, the welding spots are full, continuous welding does not occur, so that the welding quality is effectively improved, and the solder and the method are environment-friendly and safe.