Disclosed is a
copper foil having a primer resin layer for increasing the
adhesion strength between a substrate resin and a
copper foil surface which is not subjected to a roughening treatment.Also disclosed is a laminate using such a
copper foil. Specifically disclosed are a
copper foil and laminate having a primer
polyimide layer which is characterized by using a
polyimide represented by the formula (1) below as a primer resin. (1) (In the formula, R1 represents a tetravalent aromatic group which is a residue of a
dicarboxylic acid dianhydride component (pyromellitic anhydride, 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride or 2,3,6,7-naphthalenetetracarboxylic acid dianhydride); R2 represents a
divalent aromatic group which is a residue of a
diamine component (1,3-bis-(3-aminophenoxy)
benzene, 3,3'-diamino-4,4'-dihydroxydiphenylsulfone or / and 4,4'-diamino-3,3',5,5'-tetraethyldiphenylmethane); and n1 represents the number of repetition). The
copper foil and laminate have
high adhesion strength, and are thus suitably used for flexible printed wiring boards.