The present invention relates to a copper foil having a primer resin layer which improves the adhesive strength between a copper foil surface without roughening treatment and a substrate resin and a laminated sheet using the same and is characterized by using a polyimide represented by the following formula (1):
(wherein, R1 represents a quadrivalent aromatic group which is a residual group of a dicarboxylic acid dianhydride ingredient (pyromellitic acid anhydride, 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, 3,3′,4,4′-benzophenontetracarboxylic acid dianhydride or 2,3,6,7-naphthalenetetracarboxylic acid dianhydride), R2 represents a divalent aromatic group which is a residual group of a diamine ingredient (1,3-bis-(3-aminophenoxy)benzene, 3,3′-diamino-4,4′-dihydroxydiphenylsulfone or/and 4,4′-diamino-3,3′,5,5′-tetraethyldiphenylmethane), and n1 represents a repeating number) as a primer resin; and copper foils and laminated sheets having said polyimide layer as a primer have high adhesive strength and are suitable for flexible printed wiring boards.