2results about How to "The preparation process is compact" patented technology

This invention discloses an environmentally friendly water-based fire-fighting composite material for thermal runaway protection and its preparation method. The invention uses superabsorbent resin, epoxy resin, and a special fire-fighting liquid as main raw materials, which are mixed and then vibrated to form the composite material. The superabsorbent resin absorbs water to form a gel network, uniformly coating and fixing the special fire-fighting liquid to form a stable honeycomb composite structure. The epoxy resin provides mechanical support and a thermally conductive framework, jointly achieving integrated fire-fighting, heat dissipation, shock absorption, and thermal insulation functions. The material of this invention features flame retardancy, high-efficiency heat dissipation, shock absorption, and strong low-temperature adaptability. It can be filled between battery modules and PACK shells to quickly suppress fire and absorb impact during thermal runaway, while maintaining structural integrity and functional stability over a long period. The material preparation process is simple, environmentally friendly, and non-toxic, making it suitable for the safety protection of new energy battery systems.

This application discloses a method for manufacturing a power module and a power module thereof. The manufacturing method includes: providing a first substrate, the first substrate including three electrically isolated first metal layers; disposing an upper bridge chip assembly on the first metal layers, wherein the upper bridge chip in the upper bridge chip assembly is electrically connected to the first metal layers; providing a second substrate, the second substrate including three electrically isolated second metal layers; disposing a lower bridge chip assembly on the second metal layers, wherein the lower bridge chip in the lower bridge chip assembly is electrically connected to the second metal layers; connecting the upper bridge chip to the second metal layers using a first conductive buffer, and connecting the lower bridge chip to the first metal layers using a second conductive buffer. This application integrates three half-bridge structures into one unit, adopts double-sided packaging, and utilizes conductive buffer blocks to conduct current between the chip and the metal layers, shortening the current conduction distance, reducing stray inductance, and improving heat dissipation. This allows for the manufacture of a power module with simple process, small size, compact structure, and high reliability.