454 results about "2-mercaptobenzothiazole" patented technology

Disclosed are working fluid compositions for heat transfer apparatuses, such as refrigeration systems, that include a refrigerant and an ester based lubricant. The working fluid may comprise ≦50% by weight of the ester based lubricant composition and ≧50% by weight of one or more refrigerant compounds. The ester based lubricant comprises an additive selected from the group consisting of: diaryl sulfides, arylalkyl sulfides, dialkyl sulfides, diaryl disulfides, arylalkyl disulfides, dialkyl disulfides, diaryl polysulfides, arylalkyl polysulfides, dialkyl polysulfides, dithiocarbamates, derivatives of 2-mercaptobenzothiazole, derivatives of 2,5-dimercapto-1,3,4-thiadiazole, and combinations thereof. The refrigerants may be C3-C8 hydrocarbons, trichlorofluoromethane (CFC-11), dichlorodifluoromethane (CFC-12), saturated hydrofluorocarbons, difluoromethane (HFC-32), 1,1,2,2-tetrafluoroethane (HFC-134), difluoroethane (HFC-152a), fluoroethane (HFC-161), R410A (a near-azeotropic mixture of difluoromethane (HFC-32) and pentafluoroethane (HFC-125)), 1,1,1,2,3,3,3-heptafluoropropane (HFC-227ea), 1,1,1,2,3,3-hexafluoropropane (HFC-236ea), 1,1,1,3,3,3-hexafluoropropane (HFC-236fa), 1,1,1,3,3-pentafluoropropane (HFC-245fa), 1,1,1,3,3-pentafluorobutane (HFC-365mfc), hydrofluoroolefins, dimethyl ether, carbon dioxide, bis(trifluoromethyl)sulfide, and trifluoroiodomethane and combinations thereof.

An object is to provide an electroless copper plating solution that realizes uniform plating at lower temperatures, when the electroless copper plating is performed on a semiconductor wafer or other such mirror surface on which a plating reaction hardly occurs. An electroless copper plating solution, wherein, along with a first reducing agent, hypophosphorous acid or a hypophosphite is used as a second reducing agent, and a stabilizer to inhibit copper deposition is further used at the same time. Examples of the first reducing agent include formalin and glyoxylic acid, while examples of the hypophosphite include sodium hypophosphite, potassium hypophosphite, and ammonium hypophosphite. Examples of the stabilizer to inhibit copper deposition include 2,2′-bipyridyl, imidazole, nicotinic acid, thiourea, 2-mercaptobenzothiazole, sodium cyanide, and thioglycolic acid.

2-Mercaptobenzothiazole is obtained from a melt of the raw product prepared by the reaction of aniline, carbon disulphide and sulphur by pressure synthesis in a reactor, where the melt contains 2-mercaptobenzothiazole, unreacted raw materials, intermediate products and pitches, so that after reaching a stationary state of the reaction medium it includes the following steps: a) crystallization of the 2-mercaptobenzothiazole raw product from an aniline solution, b) dividing the liquid phase (FK) from crystallization from step a) in three parts, c) removing one part of the liquid phase (FK1) from crystallization from step a) out of the process, d) returning the second part of the liquid phase (FK2) from crystallization from step a) into the reactor for preparation of the raw product and supplementing it with sulphur and carbon disulphide with respect to aniline, e) final purification of the crystallized 2-mercaptobenzothiazole from step a) in the aniline liquid phase and separation of pure 2-mercaptobenzothiazole, f) using the third part of the liquid phase (FK3) from crystallization from step a), supplemented with the liquid phase (FR) from final purification from step e) and possibly with aniline for crystallization of a further batch of the 2-mercaptobenzothiazole raw product, g) using the liquid phase (FR) from final purification from step f), together with a part of the liquid phase (FK3) from step e), possibly with aniline, for crystallization of the 2-mercaptobenzothiazole raw product, wherein the steps a) to g) are repeated.