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47results about How to "Lower ionization energy" patented technology

High-mobility high-hole concentration P-type AlGaN material and growth method thereof

ActiveCN109300980AHigh Mobility High Hole ConcentrationHigh mobility and high hole concentration achievedSemiconductor/solid-state device manufacturingSemiconductor devicesCharge carrierLow mobility
The invention relates to a high-mobility high-hole concentration P-type AlGaN material and a growth method thereof and belongs to the technical field of semiconductors. With the high-mobility high-hole concentration P-type AlGaN material and the growth method thereof of the invention adopted, the problems of low mobility and low hole concentration of P-type AlGaN in the prior art can be solved. The P-type AlGaN material of the present invention comprises an aluminum nitride layer, a doped epitaxial layer and a graded epitaxial layer which are arranged sequentially from bottom to top; the aluminum nitride layer is an Al polarity surface; the doped epitaxial layer is made of a Mg doped P-type AlGaN material; the doped epitaxial layer is a metal polarity surface; the graded epitaxial layer isof a multilayer structure from bottom to top; each layer of the multilayer structure of the graded epitaxial layer is made of an unintentionally doped AlxGa1-xN material; and the Al components of theunintentionally doped AlxGa1-xN materials of the multilayer structure gradually decrease from bottom to top. According to the P-type AlGaN material of the invention, on the basis of polarization-induced charges and the separation of a carrier transport region from an impurity ionization region, high mobility and high hole concentration can be realized.
Owner:CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI

Preparation method for co-doped zinc oxide film through atomic layer deposition

The present invention discloses a preparation method for a co-doped zinc oxide film through atomic layer deposition. The preparation method comprises: placing a substrate in an ALD reaction chamber, heating the substrate and the chamber pipeline, and sequentially carrying out multi-component composite deposition, wherein the composite deposition comprises respectively introducing one doped deposition of a doped element Zr-containing doped source, second zinc source deposition, two nitrogen doped source depositions and two oxygen source depositions after first zinc source deposition to form N-Zr-N co-doping, wherein the deposition sequence of the nitrogen doped source deposition and the oxygen source deposition is that the oxygen source deposition and the nitrogen doped source deposition are sequentially performed, and the deposition sequence of the doped element Zr-containing doped source deposition and the second zinc source deposition is that the second zinc source deposition and the doped element Zr-containing doped source deposition are sequentially performed. With the method, the in situ donor-acceptor co-doping can be performed on the zinc oxide film so as to increase the doping amount of the acceptor element and promote the p type conversion of the zinc oxide film.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI

Long-acting high-voltage direct-current breakdown resistant polyethylene resin as well as preparation method and application thereof

The invention relates to long-acting high-voltage direct-current breakdown resistant polyethylene resin as well as a preparation method and application thereof, and belongs to the technical field of polyethylene resin. The problems that the existing polyethylene insulating material has inherent low breakdown field strength, and a voltage-resistant monomer is easy to migrate and separate out are solved. The long-acting high-voltage direct-current breakdown resistant polyethylene resin is prepared from the following raw materials in 100 parts by weight: 88.0-92.9 parts by weight of pre-irradiated polyethylene resin, 5-10 parts by weight of polyethylene grafted styrene polymer resin and 0.1-2.0 parts by weight of voltage-resistant monomer. The polyethylene resin voltage-resistant monomer is bonded to a polyethylene resin molecular chain, so migration and precipitation are limited, and the polyethylene resin voltage-resistant monomer has long-acting breakdown resistance; through a high-voltage direct-current breakdown experiment, the direct-current breakdown field strength is 397.8-497.6 kV / mm, and the direct-current breakdown field strength is 392.1-460.5 kV / mm after accelerated migration is carried out for 288 h at the temperature of 75 DEG C.
Owner:CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI

Preparation method for N-Zr co-doping of zinc oxide thin film

The invention discloses a preparation method for N-Zr co-doping of a zinc oxide thin film. The method comprises the steps of placing a substrate in an ALD reaction chamber, heating the substrate and a chamber pipeline, and then carrying out multi-component composite deposition. The composite deposition comprises: after primary zinc source deposition, respectively introducing doping deposition of a doping source containing a doping element Zr for one time, secondary zinc source deposition, nitrogen doping source deposition for two times and oxygen source deposition for two times, and thus forming N-Zr-N co-doping; the sequence of the nitrogen doping source deposition and the oxygen source deposition is that firstly the nitrogen doping source deposition is carried out and then the oxygen source deposition is carried out; the sequence of the doping element Zr-containing doping source deposition and the secondary zinc source deposition is that firstly the doping element Zr-containing doping source deposition is carried out and then the secondary zinc source deposition is carried out. The method can be used for in-situ donor-acceptor co-doping on the zinc oxide thin film, so as to increase the doped amount of the acceptor element, and promote p-type conversion of the zinc oxide thin film.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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