The invention discloses a heat-insulation wallboard with a low heat transfer coefficient, containing the following materials in parts by weight: 80-120 parts of cement, 30-50 parts of prefabricated expanded perlite, 40-60 parts of styrene-acrylic emulsion, 20-40 parts of poly-acrylonitrile base carbon fiber, 30-40 parts of glass fiber, 8-16 parts of gypsum, 15-20 parts of ultra-high molecular weight polyethylene fiber, 5-10 parts of steel fiber, 2-8 parts of kieselguhr, 15-25 parts of esterified starch, 10-20 parts of coal ash, 8-16 parts of talcum powder, 10-20 parts of calcium carbonate, and5-10 parts of mica powder. The prefabricated expanded perlite is prepared by adopting the following process: uniformly mixing gelatin, expanded perlite and hydrogen peroxide solution, filtering, adjusting the system to be neutral, adding ammonium persulfate and sodium hydrogen sulfite under nitrogen protection and stirring, adding acrylamide and stirring, precipitating, and drying, thus obtainingthe prefabricated expanded perlite.