The application discloses a kind of
semiconductor wafer cutting equipment and method thereof, it is related to
wafer cutting technical field, the
semiconductor wafer cutting equipment, including protective shell, the inside of the protective shell is provided with
crystal bar support component and cutting component,
crystal bar support component is located above cutting component,
cutting fluid supply device is further provided in the protective shell, the
cutting fluid supply device is used to carry out
fluid supply to
crystal bar cutting site, the
cutting fluid supply device is installed between crystal bar support component and cutting component,
diamond solidification mechanism is provided on the cutting component, the
diamond solidification mechanism is used to supplement
diamond particles on diamond steel wire and solidifies diamond particles, diamond particle
slurry is filled with the material that is cured quickly by
ultraviolet light, so diamond particle
slurry can be cured quickly by photo-curing lamp
irradiation, to prevent cutting fluid from flushing away diamond particles as far as possible.