2results about How to "Solve refractory" patented technology

The utility model belongs to the technical field of disposable lunch boxes, and particularly relates to a biodegradable disposable lunch box which comprises a box body formed by hot press molding of a bamboo fiber matrix, the box body comprises a box bottom and a box cover which extends upwards along one end of the box bottom and can be buckled in a separable mode, a buckling groove which extends outwards horizontally is formed in the edge of the other end of the box bottom, and a buckling skirt edge is arranged at the position, corresponding to the buckling groove, of the box cover; the top end face of the box bottom and the bottom end face of the box cover are each provided with a contact plane, the two contact planes are folded outwards in the horizontal direction to form horizontal reinforcing edges, and the thickness of the horizontal reinforcing edges is larger than that of the box body. The box body formed by hot pressing of bamboo fibers is free of chemical harm and biodegradation, pollution is reduced, the environment-friendly, safe and sustainable requirements are met, the meal box is provided with the separable buckling cover and connected through the groove edge, sealing is guaranteed, food is prevented from overflowing, the top face of the box bottom cover is provided with the contact plane and the reinforcing edge, the structural strength is improved, deformation is prevented, durability is achieved, and use is guaranteed.

This invention provides a method for preparing an aluminum-silicon-copper sputtering target. The method includes: (I) providing aluminum, silicon, and copper raw materials, and dividing the aluminum raw material into two parts; (II) melting one part of the aluminum raw material to obtain an aluminum melt, then adding the silicon and copper raw materials to the aluminum melt, and performing a first melting at a first temperature to obtain a primary alloy melt, adding the remaining aluminum raw material to the aluminum-silicon-copper alloy melt, and performing a second melting at a second temperature to obtain a secondary alloy melt; (III) sequentially degassing, refining, and slag removal from the secondary alloy melt to obtain a purified alloy melt; (IV) sequentially casting and cooling the purified alloy melt to obtain an aluminum-silicon-copper ingot; wherein the first temperature is higher than the second temperature. This invention solves the problem of Si element aggregation in high-purity aluminum-silicon-copper alloys and can avoid silicon segregation in alloy ingots.