Provided are: an antistatic resin composition which exhibits long-lasting and sufficient antistatic properties, and substantially no ion elution when formed into a moulded article, and which is suitable for packaging materials and containers for accommodating / transporting electrical and electronic components; and a container and a packaging material which use said antistatic resin composition. The antistatic resin composition includes, per 100 parts by mass of a synthetic resin, 3-20 parts by mass of at least one polymer compound (E), and 0.1-5 parts by mass of a salt (F) of at least one alkali metal. The polymer compound (E) is provided with a structure obtained by bonding, via ester bonds, or ester bonds and amide bonds, a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (D) having a reactive functional group, and a compound (B) which has at least one group represented by general formula (1), namely -CH2-CH2-O-, and which has hydroxyl groups provided to both terminals.