A low-density, high-temperature,
creep-resistant benzoxazine
hybrid epoxy paste and its preparation method are disclosed, relating to the field of
adhesive technology. The aim is to address the insufficient long-term high-temperature
creep resistance of existing lightweight
epoxy adhesives. The paste is prepared from the following raw materials: Raw materials are weighed, and
amide-containing trifunctional benzoxazine resin,
amide-containing difunctional benzoxazine resin,
amide-containing monofunctional benzoxazine resin, multifunctional
epoxy resin,
bisphenol A type epoxy resin, and
toughening agent are added to a reaction vessel. The mixture is heated and stirred to obtain a homogeneous resin premix. The mixture is then cooled, and hollow glass microspheres, a
coupling agent, and 2-methyl-pyrazolo[1,5-A]
pyrimidine-6-
carboxylic acid are added, and the mixture is stirred to obtain an
intermediate product. Finally, a curing agent is added and stirred to obtain the low-density, high-temperature,
creep-resistant benzoxazine
hybrid epoxy paste. This invention is applicable to structural bonding applications in
aerospace,
rail transportation, and
electronic packaging where lightweighting and long-term high-temperature reliability are critical.