The invention discloses a preparation process of a heat-conducting and electric-conducting
power module, and relates to the technical field of semiconductors, and the preparation process comprises the following steps: 1, carrying out primary
sand blasting treatment on a spraying area on an aluminum radiator; 2, spraying a first
copper-clad layer on the spraying area; 3, carrying out secondary
sand blasting treatment on the first
copper-clad layer; 4, spraying a second
copper-clad layer on the first copper-clad layer; 5,
laser is emitted to irradiate the second copper-clad layer, so that the surface of the second copper-clad layer is softened, a third copper-clad layer is sprayed on the second copper-clad layer, and a heat-conducting and heat-conducting electroplated copper layer is obtained; 6, eliminating the
internal stress of the heat-conducting and heat-conducting electroplated copper layer by using a directional high-frequency
magnetic field; and 7, directly installing a
chip on the heat-conducting and
electricity-conducting
electroplating copper layer to obtain the heat-conducting and
electricity-conducting
power module. According to the process,
sand blasting and cold spraying are alternately carried out, and the procedures of
softening copper
powder and eliminating stress are added, so that the
internal stress of a
copper plating layer can be eliminated, pores can be reduced, and the
binding force between the
copper plating layer and an aluminum radiator and the
binding force between copper
powder particles can be increased.