The invention provides
diamond wire cutting cooling liquid for
silicon carbide wafer cutting, and particularly relates to the field of
silicon carbide cutting liquid. The
cutting coolant comprises the following components in parts by weight: 5-20 parts of
polyol ester, 10-30 parts of
fatty alcohol polyoxyethylene polyoxypropylene
ether, 0.5-15 parts of poly (4-vinyl benzyl-tri (2-cyanoethyl)
phosphonium chloride, 1-5 parts of a catalyst, 1-5 parts of a defoaming agent and 1-5 parts of an
antioxidant. The
cleaning agent is prepared from the following components in parts by weight: 0.01 to 1 part of
aromatic acid, 0.05 to 2 parts of macromolecular
viscosity modifier, 0.05 to 5 parts of
zinc dialkyl dithiophosphate, 2 to 20 parts of alkynediol gemini surfactant, 0.1 to 2 parts of pH
regulator, 0 to 20 parts of
organic solvent, 0.02 to 2 parts of organic
silicon defoaming agent and 10 to 50 parts of deionized water. The
diamond wire cooling liquid for
silicon carbide wafer cutting provided by the invention has the characteristics of large boundary lubricating film thickness and high boundary lubricating film strength. The cutting mode of the
silicon carbide wafer from the
diamond powder abrasive mortar and the steel wire is replaced by the diamond
wire cutting mode, and the purposes of improving the cutting efficiency, reducing TTV, improving surface line marks and reducing the smudginess rate are achieved.