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37results about How to "Achieve epitaxial growth" patented technology

Method for preparing transition metal chalcogenide/two-dimensional layered material interlayer heterogeneous structure through two-step chemical vapor deposition method

The invention discloses a method for preparing a transition metal chalcogenide / two-dimensional layered material interlayer heterogeneous structure through a two-step chemical vapor deposition method. The method comprises the following steps that (1) gold foil is cleaned and subjected to high-temperature pre-annealing treatment; (2) the annealed gold foil is placed in a high-temperature tube furnace, a two-dimensional layered material is grown on the gold foil through the low-pressure chemical vapor deposition method, and a two-dimensional layered material / gold foil sample is obtained after the temperature is lowered to the room temperature; (3) the two-dimensional layered material / gold foil sample is put into a second high-temperature tube furnace, and powdered sulfur, molybdenum oxides and the two-dimensional layered material / gold foil are sequentially arranged according to the order from the upstream portion to the downstream portion; (4) argon and hydrogen are pumped into a reaction chamber, and molybdenum disulfide is grown; and (5) after growing of molybdenum disulfide is finished, the molybdenum disulfide / two-dimensional layered material interlayer heterogeneous structure on the gold foil is obtained.
Owner:PEKING UNIV

High-temperature large area silicon carbide epitaxial growth device and treatment method

The invention discloses a high-temperature large area silicon carbide epitaxial growth device and a treatment method. The high-temperature large area silicon carbide epitaxial growth device comprises a closed working chamber made of stainless steels, a graphite reaction cavity chamber arranged in the working chamber and a heating component arranged at the periphery of the reaction cavity chamber, wherein a tray groove is arranged in the reaction cavity chamber, a tray which bears a silicon carbide substrate is arranged in the tray groove, the reaction cavity chamber is provided with a penetrating channel, and a gas inlet device and a gas outlet device are respectively arranged at two ends of the channel. During treatment, the silicon carbide substrate is put into the reaction cavity chamber and then vacuumized and heated, reaction gas is introduced into the reaction cavity chamber so as to allow epitaxial growth of the silicon carbide, and then the silicon carbide taken out. Compared with the traditional quartz tube structure, the high-temperature large area silicon carbide epitaxial growth device has a simple structure, is relatively easy to manufacture, is convenient to process and can be used for treating the silicon carbide with a larger area. In addition, according to the high-temperature large area silicon carbide epitaxial growth device disclosed by the invention, the working chamber is in a water-cooling stainless steel structure, has higher strength and is not easy to damage.
Owner:DONGGUAN TIANYU SEMICON TECH

Heterotopic multi-metal oxide film epitaxial growth and continuous preparation method

The invention provides a heterotopic multi-metal oxide film epitaxial growth and continuous preparation method. According to the characteristics of a metal target, the initial component evaporation isperformed; after nanoparticles evaporated from the target the high vacuum state reach the substrate, the nanoparticles are deposited into an amorphous metal precursor film; after deposition, the precursor film is transported to low-pressure atmospheres with different oxygen partial pressures; and at different temperatures, crystallization and epitaxial growth are performed. By the method, co-evaporation of multi-metal elements with different melting points and sublimation temperatures is realized, the evaporation technology and conditions of the elements can be selected according to characteristics of the constituent elements, and the dynamic baseband can help realize the uniformity of the precursor component; the later oxidation treatment starts with the highly-refined nano-scale precursor, nucleation centers of later crystallization growth are many, and growth is fast and density is high; and by controlling the oxygen partial pressure, the reaction heat-treatment can be realized ata lower temperature, and then crystallization and epitaxial growth can be achieved at low temperature. The preparation method is simple.
Owner:SHANGHAI UNIV

Flexible ferroelectric film containing defect dipole and manufacturing method

The invention discloses a flexible ferroelectric film containing a defect dipole and a manufacturing method. The film mainly comprises a mica substrate, a buffer layer CoFe2O4 film, a bottom electrode layer SrRuO3 film and a ferroelectric functional layer Pb (Zr0. 2Ti0. 8) O3 film, wherein the buffer layer CoFe2O4 film, the bottom electrode layer SrRuO3 film and the ferroelectric functional layer Pb (Zr0. 2Ti0. 8) O3 film sequentially grow on the mica substrate. In the manufacturing method, a pulse laser deposition process is adopted, and volatilization of Pb ions in the Pb (Zr0. 2Ti0. 8) O3 ferroelectric film is controlled by using different process parameters, so that Pb ion vacancies are introduced into the ferroelectric film to be combined with O vacancies to form defect dipoles. A ferroelectric domain overturning process can be effectively regulated and controlled by introducing a defect dipole into the ferroelectric functional layer, so that the change quantity of a polarization state is improved, a giant electrocaloric effect is generated near the room temperature, and the change quantity of polarization intensity before and after an external electric field is applied and removed can reach 50 [mu] C/cm < 2 >; wide application prospects are realized in the field of solid-state refrigeration.
Owner:XIANGTAN UNIV

Graphite substrate for improving wavelength uniformity of epitaxial wafer

The invention provides a graphite substrate for improving the wavelength uniformity of an epitaxial wafer, and belongs to the technical field of semiconductors. The graphite base plate comprises a first base plate, a second base plate and an exhaust device, and the first base plate and the second base plate are both discs; the upper surface of the first substrate is provided with a plurality of circles of first grooves for accommodating substrates, the middle part of the first substrate is provided with a circular pit, and the bottom of the circular pit is provided with a plurality of air holes; the second substrate is coaxially arranged in the circular pit, and the upper surface of the second substrate is provided with a plurality of circles of second grooves for accommodating the substrate; and the exhaust device is configured to provide gas with set flow for the plurality of gas holes in different working states, so that the second substrate is suspended in the circular pit and is separated from the first substrate, and the second substrate and the first substrate rotate in the same direction or in the opposite direction at a set rotating speed. The epitaxial wafer grows on the graphite substrate provided by the invention, so that the wavelength uniformity of the epitaxial wafer growing in each groove of the graphite substrate can be improved.
Owner:HC SEMITEK ZHEJIANG CO LTD

InAs/GaSb buffer layer, silicon-based antimonide semiconductor material, preparation method of silicon-based antimonide semiconductor material, and component

The invention provides an InAs / GaSb buffer layer, a silicon-based antimonide semiconductor material, a preparation method of the silicon-based antimonide semiconductor material, and a component. The InAs / GaSb buffer layer comprises one or more basic buffer units, wherein each basic buffer unit comprises one or more basic unit layers, and each basic unit layer comprises one or more groups of GaSb parts and InAs parts which are alternately arranged. The silicon-based antimonide semiconductor material comprises a silicon substrate and a pure gallium antimony layer, where the InAs / GaSb buffer layer is arranged between the silicon substrate and the pure gallium antimony layer. The preparation method comprises the following steps: growing the GaSb parts and the InAs parts on the silicon substrate to obtain a plurality of the basic unit layers; and then growing the pure gallium antimony layer. Raw materials of the component comprise the InAs / GaSb buffer layer or the silicon-based antimonide semiconductor material. According to the InAs / GaSb buffer layer provided by the invention, lattice mismatch between silicon and GaSb can be reduced, so high-quality antimonide epitaxial growth is realized.
Owner:湖南科莱特光电有限公司

Method for epitaxial growth of monocrystalline barium titanate film on germanium substrate

The invention discloses a method for epitaxial growth of a monocrystalline barium titanate film on a germanium substrate, and belongs to the field of epitaxial preparation of monocrystalline films. The method comprises the following steps: ultrasonically cleaning a (001)-oriented Ge substrate, filling the chamber of a pulsed laser deposition system with the (001)-oriented Ge substrate, evacuatingthe chamber to the vacuum of the background, heating the substrate to 800 DEG C, maintaining a certain pressure and a certain temperature, annealing the substrate to reconstruct the surface in order to crystallize the film in the subsequent film growth process, adjusting the pressure and the temperature, controlling the temperature to be 500-800 DEG C, turning on a laser to grow a film, stopping the growth after the film grows to a certain degree, naturally cooling the substrate, introducing air into the chamber after the obtained sample is cooled to room temperature, opening the chamber, andtaking out the sample to complete growth. The method simply and cheaply realizes the epitaxial growth of the barium titanate film on Ge, and the obtained film has the characteristics of clear interface, monocrystalline epitaxial growth and smooth film surface.
Owner:XI AN JIAOTONG UNIV

Cubic texture Ce1-sigmaGdsigmaO2 film on NiW alloy substrate and preparation method thereof

The invention belongs to the technical field of the superconducting material, and particularly relates to a cubic texture Ce1-sigmaGdsigmaO2 film on a NiW alloy substrate and a preparation method thereof. The Ce1-sigmaGdsigmaO2 film is grown on the Ni-5%W alloy substrate of the cubic texture, has the thickness of 200-500nm and has a (200) preferred orientation and face-centred cubic crystal structure, and the texture is {100}(001), wherein sigma is more than or equal to 0.1 and less than or equal to 0.2. The preparation method comprises the following steps of: dissolving (CH3CO2)3Ce(III) and GdN3O9 into C2H5OOH to obtain Ce1-sigmaGdsigmaO2 precursor liquid, coating the precursor liquid onto the Ni-5%W alloy substrate in a spinning mode, and sending the spin coating substrate into a furnace tube for thermal treatment. The CGO (Ce1-sigmaGdsigmaO2) buffer layer disclosed by the invention has the face-centred cubic crystal structure, the a and b axis lattice constants of YBCO (yttrium barium copper oxide) are almost same with the semi-diagonal length of the CGO(001) surface; after a YBCO(001) surface and after the CGO(001) surface are relatively rotated for 45 degrees in an in-plane mode, good lattice match can be formed; and the epitaxial growth of a YBCO superconducting film can be realized, thereby providing a great significance for improving the superconducting performance of the superconducting material prepared with a chemical method.
Owner:NORTHEASTERN UNIV

A high-temperature large-area silicon carbide epitaxial growth device and processing method

The invention discloses a high-temperature large area silicon carbide epitaxial growth device and a treatment method. The high-temperature large area silicon carbide epitaxial growth device comprises a closed working chamber made of stainless steels, a graphite reaction cavity chamber arranged in the working chamber and a heating component arranged at the periphery of the reaction cavity chamber, wherein a tray groove is arranged in the reaction cavity chamber, a tray which bears a silicon carbide substrate is arranged in the tray groove, the reaction cavity chamber is provided with a penetrating channel, and a gas inlet device and a gas outlet device are respectively arranged at two ends of the channel. During treatment, the silicon carbide substrate is put into the reaction cavity chamber and then vacuumized and heated, reaction gas is introduced into the reaction cavity chamber so as to allow epitaxial growth of the silicon carbide, and then the silicon carbide taken out. Compared with the traditional quartz tube structure, the high-temperature large area silicon carbide epitaxial growth device has a simple structure, is relatively easy to manufacture, is convenient to process and can be used for treating the silicon carbide with a larger area. In addition, according to the high-temperature large area silicon carbide epitaxial growth device disclosed by the invention, the working chamber is in a water-cooling stainless steel structure, has higher strength and is not easy to damage.
Owner:DONGGUAN TIANYU SEMICON TECH
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