2results about How to "Reduce sintering energy consumption" patented technology

The invention belongs to the technical field of electronic paste, and discloses low-temperature-coefficient resistance paste for a potentiometer and a preparation method of the low-temperature-coefficient resistance paste. The resistance paste is composed of a conductive phase, a glass phase and an organic carrier, the conductive phase is bismuth ruthenate nanowires and carbon-coated copper nanowires, the glass phase comprises Bi2O3, B2O3, SiO2 and La2O3, and the organic carrier is composed of ethyl cellulose and terpilenol. The preparation method comprises the following steps: respectively preparing the components, mixing in proportion, and rolling by a three-roller mill. The TCR value of a resistive layer formed by the paste is controlled to be + / -50 ppm / DEG C, the resistance change is lower than 0.8% after 1000 times of-55-125 DEG C cold and hot cycles, low-temperature sintering can be achieved, the silver migration resistance is excellent, the high-frequency insertion loss of the 3GHz frequency band is low, the sheet resistance uniformity is good, and the paste is suitable for the miniaturization, high precision and high-frequency scene requirements of high-end potentiometers.

This invention discloses a nanoscale α-alumina and its preparation method. Polyethylene glycol, citric acid, and ammonium aluminum sulfate are sequentially added to a urea solution and mixed to obtain a mixed solution. Ammonia water is then added dropwise to the mixed solution, and the mixture is allowed to stand and age to obtain a precursor suspension. The precursor suspension is then separated into solid and liquid phases, and the resulting solid phase is the alumina precursor. The alumina precursor is then calcined to obtain α-alumina. The α-alumina provided by this invention is a pure phase, free of impurities such as γ-Al₂O₃, with a complete crystal structure, a particle size ≤150 nm, a particle size distribution CV value <15%, excellent dispersibility, no obvious hard agglomerates, and a higher specific surface area, making it suitable for applications in high-end electronic ceramics, precision polishing, and other fields.