2results about How to "Solve pollution discharge" patented technology

This disclosure provides a method and system for removing zinc from galvanized steel sheets, belonging to the field of resource recycling technology. The method includes: pickling and immersing the galvanized steel sheet in an inorganic acid to obtain a zinc salt solution and hydrogen gas; subjecting the zinc salt solution to multi-effect evaporation to obtain a concentrated solution and a condensate of the inorganic acid, the condensate of which is reused in the pickling process; calcining the concentrated solution to obtain solid oxides and tail gas containing hydrogen chloride or sulfur trioxide, the tail gas being reused in the pickling process; magnetically separating the solid oxides to obtain magnetic and non-magnetic oxides; and using the hydrogen gas generated from the pickling process to reduce the non-magnetic oxides, which are then collected by condensation to obtain zinc metal with a purity greater than 99%. This disclosure achieves closed-loop utilization of hydrochloric acid or sulfuric acid and water resources, with high zinc recovery rate, low energy consumption, and both economic and environmental benefits.

The invention provides a polishing solution and a surface post-treatment method of a semiconductor structural member. The polishing solution is prepared from the following raw materials in percentage by volume: 1-15 parts of diamond micro powder, 30-50 parts of animal fat, 0.5-1 part of potassium hydroxide, 0.5-3.5 parts of polyethylene glycol and 50-70 parts of water. The surface post-processing method comprises the following steps that a profiling tool groove is customized according to the size of a semiconductor structural part to be processed, and the profiling tool groove is installed on a carrying table; a semiconductor structural part to be machined is adsorbed and placed on the profiling tool groove, and then polishing liquid is added into the profiling tool groove; and a polishing head is installed, and the semiconductor structural part to be machined is automatically polished. In the grinding process, the efficiency is considered while the grinding head and the to-be-machined semiconductor structural part (workpiece) are lubricated, the heating probability of the contact face between the grinding head and the workpiece is reduced to the minimum under the action of the grinding liquid, meanwhile, the service life of the grinding water solution is prolonged, and the problem of wastewater pollution discharge is completely eradicated.