2 results about "Titanium gold" patented technology

This invention relates to the field of heat sink materials, specifically to a modified gold-tin-hard gold-plated heat sink material, its preparation method, and its application. The modified gold-tin-hard gold-plated heat sink material comprises, from bottom to top, a first heat sink layer, a nickel plating layer, a gold plating layer, a gold-tin solder layer, another gold plating layer, a nickel plating layer, a second heat sink layer, a nickel plating layer, a hard gold plating layer, and a modified gold-tin-silicon solder layer. The first heat sink layer is oxygen-free copper, and the second heat sink layer is either molybdenum copper or tungsten copper. The hard gold plating layer comprises, from bottom to top, a nickel plating layer and a tungsten-titanium gold plating layer. This invention introduces tungsten and titanium into the gold plating layer on the surface of the heat sink material, significantly enhancing the hardness and corrosion resistance of the gold plating layer; it incorporates a small amount of silicon into the gold-tin solder, improving the ductile processing performance of the brittle gold-tin solder; and it achieves one-time molding of the solder-heat sink composite material through vacuum hot-press welding, reducing voids or overflow problems caused by solder dimensional errors during welding.

1. The name of the design product: mobile power supply (titanium gold ring series). 2. The use of the design product: for mobile power supply. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.