2results about How to "Uniform surface topography" patented technology

A method for manufacturing high-strength, hydrogen-embrittlement-resistant bolts based on microsphere shot peening, and the bolts themselves, are disclosed. The manufacturing method includes: S1, cold heading and thread rolling of alloy structural steel billets to obtain bolt forming parts; S2, surface cleaning of the bolt forming parts, followed by overall surface peening with microspheres driven by high-pressure air; after overall peening, targeted strengthening peening treatment is performed on stress concentration areas such as thread roots, undercut grooves, and flange transition corners to obtain reinforced bolt parts; S3, the reinforced bolt parts are cleaned, dried, and phosphated to obtain finished bolt parts. This design, through a "overall + targeted" composite microsphere shot peening strategy, introduces a uniform residual compressive stress field and a micron-level fine-grained plastic deformation layer on the bolt surface, forming a thicker strengthening layer in stress concentration areas, significantly improving the fatigue strength and delayed fracture resistance of high-strength bolts, while ensuring uniform surface roughness and stable assembly friction coefficient.

The application discloses a processing method of an upper dielectric layer of a lower electrode and a manufacturing process of the lower electrode. The processing method of the upper dielectric layer comprises the following steps: performing plasma spraying on a surface of an electrode layer to form the upper dielectric layer, wherein the spraying route of the plasma spraying is N scanning paths in S shape, and the starting points of the N scanning paths are staggered by a distance d in the same direction; sealing holes; grinding; and sand blasting, wherein the sand blasting route is the same as the spraying route. In the spraying and sand blasting processes of the upper dielectric layer, a plurality of offset paths are adopted, the uniformity of the superposition area is increased, the wave shape formed on the surface of the upper dielectric layer is reduced, and the uniformity of the surface of the upper dielectric layer is improved. Therefore, the non-uniform cooling of a glass substrate caused by the difference in the dry etching process is reduced, and the generation of mura in the dry etching process is reduced.