The invention discloses a board-level packaging structure and a manufacturing process thereof, the board-level packaging structure comprises a packaging body and a terminal, at least part of the terminal protrudes out of the surface of the packaging body, the side wall of the terminal is provided with a step-shaped structure, and a
metal surface area capable of being wetted by
welding flux is formed on the lower portion of the step-shaped structure. According to the invention, the wettability side surface is created through the step-shaped structure, so that the liquid solder can fully wet and wrap the side wall of the terminal, a firm, complete and void-free three-dimensional
welding interface is formed, and the connection reliability is greatly improved; the effective
welding area is increased, the interface
thermal resistance is reduced, and the heat dissipation capability is improved; meanwhile, the firm lateral connection enhances the mechanical stress and thermal
stress resistance of the packaging body, so that the
power cycle life is prolonged, and the overall reliability is improved; on the basis of a mature board-level packaging process, only a pre-
cutting step needs to be added before a final
cutting process, so that the technological process is slightly changed, the equipment compatibility is high, the implementation is easy, and the cost is controllable.